Selective Adhesive Curing for Semiconductor Wafer Detachment
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge in manufacturing semiconductor devices is the damage to the product substrate during detachment from a carrier substrate due to adhesive residue and the complexity of removing the adhesive layer, which complicates the process.
Innovation Solution
A method involving a light blocking film and a photosensitive adhesive layer is used, where the adhesive layer is partially cured to maintain stability during processing and easily detached using different wavelength light, minimizing adhesive residue and simplifying the detachment process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a thermosetting resin adhesive layer is used to bond the product substrate to the carrier substrate, then the product substrate is supported during the process, but the adhesive layer cannot be easily removed and may damage the product substrate
Solution Approach 1:
The adhesive layer is segmented into two distinct layers: a lower adhesive layer made of thermosetting resin that provides strong bonding stability, and an upper release layer made of photopolymerizable resin that enables easy removal. This segmentation allows each layer to perform its specific function optimally without compromising the other.
Solution Approach 2:
The invention changes the chemical and physical parameters of the adhesive system by using two different resin types with distinct curing mechanisms. The thermosetting resin undergoes irreversible curing for stable bonding, while the photopolymerizable resin can be reversibly cured and uncured using light exposure, enabling controlled adhesion and release.
2Strength
If the adhesive layer is fully cured to ensure strong bonding, then the product substrate is securely fixed, but the detachment process becomes complicated and requires additional removal steps
Solution Approach 1:
The release layer is prepared in advance with photopolymerizable resin that can be selectively cured. This preliminary preparation allows the adhesive system to be activated only when needed, and deactivated easily when detachment is required, avoiding the need for complex removal procedures.
Solution Approach 2:
The photopolymerizable release layer acts as an intermediary between the product substrate and the carrier substrate. It mediates the bonding process by providing temporary, controllable adhesion that can be easily reversed, simplifying the overall detachment process compared to direct thermosetting resin bonding.
3Ease of operation
If a light-transmitting carrier substrate is used with a light blocking film and photosensitive adhesive layer, then the adhesive can be partially cured for easy detachment, but the process requires multiple light irradiation steps
Solution Approach 1:
The light blocking film creates local quality differences in the adhesive layer by preventing light from reaching certain areas. This allows selective curing: the adhesive under the light blocking film remains uncured for easy detachment, while other areas are fully cured for stable bonding, optimizing both ease of operation and productivity.
Solution Approach 2:
The curing process uses periodic light irradiation through the light-transmitting carrier substrate. By controlling the timing and duration of light exposure, the adhesive can be partially cured to achieve the desired balance between bonding stability and detachment ease, improving overall manufacturing efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively prevents damage to the product substrate and simplifies the detachment process by maintaining adhesive force where needed and allowing easy removal of the carrier substrate, reducing mechanical impact and contamination.
Implementation Method 1
forming a light blocking film configured to block first light within a first wavelength band on an edge region of an upper surface of a light-transmitting carrier substrate
Implementation Method 2
partially curing the photosensitive adhesive layer by irradiating the first light through the light-transmitting carrier substrate
Implementation Method 3
a light-transmitting carrier substrate
Data Source
AI summary
A method of manufacturing a semiconductor device includes forming a light blocking film configured to block first light within a first wavelength band on an edge region of an upper surface of a light-transmitting carrier substrate; forming a photosensitive adhesive layer on the upper surface of the light-transmitting carrier substrate to at least partially cover the light blocking film; bonding a product substrate to the upper surface of the light-transmitting carrier substrate using the photosensitive adhesive layer; partially curing the photosensitive adhesive layer by irradiating the light through the light-transmitting carrier substrate, wherein a portion of the photosensitive adhesive layer overlapping the light blocking film is not cured; processing the product substrate to form a plurality of semiconductor devices after the partially curing of the photosensitive adhesive layer; and cutting the product substrate such that the plurality of semiconductor devices are cut into a plurality of separate individual semiconductor devices.