Selective Coating via Carrier Substrate Roller Transfer
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Solution Overview
Problem
In the semiconductor industry, existing methods for applying thin layers to substrates often require complete surface coating, which is not feasible for all applications, and masking techniques are costly and complex, while microcontact printing requires multiple process steps and new stamps for each type of product wafer.
Innovation Solution
A method and device where a carrier substrate with coating material is partially contacted with the product substrate, using a roller to transfer the coating material exclusively to elevated structures, eliminating the need for extensive alignment and process steps, and allowing for reuse of the carrier substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If masking techniques (photolithography or imprint lithography) are used to prevent coating of areas that should not be coated, then coating precision is improved, but device complexity and process steps increase significantly
Solution Approach 1:
Instead of coating the entire surface and then removing material from areas that should not be coated (conventional masking approach), the invention inverts the process by directly depositing coating material only on the specific areas that require coating. This is achieved through a selective area deposition technique where a mask layer with openings is applied, and coating material is deposited only through these openings onto the target areas, eliminating the need for complex post-coating removal steps and reducing overall process complexity
Solution Approach 2:
The mask layer is segmented with specific openings positioned at the areas requiring coating. This segmentation allows the coating process to be divided into selective areas, enabling precise deposition only where needed while leaving other areas untouched. The segmented mask structure simplifies the overall process by eliminating the need for complete surface coating followed by complex patterning and removal steps
2Manufacturing precision
If microcontact printing (μCP) is used for partial coating, then coating precision is improved, but device complexity and process steps increase due to stamp manufacturing and alignment requirements
Solution Approach 1:
The invention merges the mask layer with the substrate surface, eliminating the need for a separate μCP stamp. The mask layer is directly applied to the substrate and serves both as the coating template and as part of the final structure. This integration eliminates the complex steps of stamp manufacturing, material saturation, and precise alignment that are required in μCP, while maintaining the ability to achieve precise partial coating
Solution Approach 2:
The invention extracts the complex alignment and stamp manipulation steps from the coating process. By using a directly applied mask layer that is integrated with the substrate, the process eliminates the need for separate stamp alignment relative to raised structures. The coating material is deposited through the mask openings directly onto the target areas without requiring complex positioning or alignment procedures
3Manufacturing precision
If direct deposition processes are used to coat thin layers, then coating quality is improved, but the entire surface is coated which is not acceptable for some applications
Solution Approach 1:
The invention applies local quality by creating spatial variation in the mask layer properties. The mask layer contains openings at specific locations while remaining intact in other areas, allowing coating material to deposit only on the exposed regions. This local differentiation enables direct deposition processes to achieve both high coating quality on target areas and selective area coverage, making the process adaptable to various applications requiring different coating patterns
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables partial coating of substrates with reduced process steps, lower costs, and increased throughput, while maintaining high precision and adaptability for various substrate types, including those with complex geometries.
Implementation Method 1
by a further process step, in particular force transmission by a roller, the coating material is transferred from the carrier substrate to the raised structures of the product substrate
Data Source
Figure 1a~1b
Figure 2a~2d
Figure 2e~2g
AI summary
The invention relates to a method for coating a raised surface (5o, 5') of especially discrete elevations (5, 5') on a product substrate (3, 3') having functional units (6) that are arranged at least in part, preferably for the most part, in depressions (7), said method involving the following steps, in particular the following sequence: bringing the raised surface (5o, 5o') in contact with a coating material (2, 2') applied to a carrier substrate (1); separating the carrier substrate (1) from the raised surface (5o, 5o') in such a way that some of the coating material (2, 2') remains on the product substrate (3, 3'). The invention further relates to a corresponding device.