Selective Component Transfer via Intermediary Substrate Bonding
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Solution Overview
Problem
Existing methods for transferring components from a sender substrate to a receiver substrate lack the ability to selectively exclude defective components, leading to inefficiencies in the semiconductor industry, particularly in the production of light-emitting diodes where only functional components should be transferred.
Innovation Solution
A method utilizing a transfer substrate with bonding and debonding means, such as lasers, to selectively transfer components by fixing or releasing them individually, ensuring only functional components are transferred, with alignment and testing processes to ensure precise positioning and functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional transfer methods are used to transfer components from sender substrate to receiver substrate, then the transfer process is simple and fast, but defective components cannot be excluded and are transferred along with functional components
Solution Approach 1:
A transfer substrate is introduced as an intermediary carrier between the sender substrate and the receiver substrate. The transfer substrate temporarily holds the components during the transfer process, enabling selective bonding and debonding operations. This intermediary approach allows for quality control (testing and selection) without complicating the overall transfer system architecture.
Solution Approach 2:
Components are tested and selected for functionality before the final transfer to the receiver substrate. The bonding means are activated selectively based on test results, ensuring that only functional components are transferred. This preliminary quality control action prevents defective components from reaching the receiver substrate.
2Reliability
If selective transfer of components is implemented to exclude defective components, then only functional components are transferred, but the transfer process requires additional bonding and debonding operations increasing process complexity
Solution Approach 1:
The transfer process uses periodic bonding and debonding actions controlled by the bonding means. The bonding means are activated in periods or cycles to selectively bond functional components to the transfer substrate, then debond them for transfer to the receiver substrate. This periodic control enables selective transfer while maintaining systematic process flow.
3Productivity
If all components are transferred from sender substrate to receiver substrate without selection, then transfer speed is high and process is simple, but defective components contaminate the final product
Solution Approach 1:
Defective components are extracted or excluded from the transfer process through selective bonding control. The bonding means are programmed to activate only for components that pass quality tests, effectively taking out defective components from the transfer stream. This extraction approach maintains high transfer speed for functional components while eliminating defective ones.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the selective transfer of functional components, reducing defective products and improving production efficiency by ensuring only working components are moved from the sender to the receiver substrate, enhancing the semiconductor industry's component transfer processes.
Implementation Method 1
bonding means (6), in particular by means of a laser
Implementation Method 2
The adhesive property of an adhesive area (3) is changed by means of the bonding means (6)
Implementation Method 3
debonding means (7), in particular by means of a laser
Implementation Method 4
The adhesive property of an adhesive area (3) is changed by means of the debonding means (7)
Data Source
AI summary
A method for the transfer of components from a sender substrate to a receiver substrate includes provision and/or production of the components on the sender substrate, transfer of the components of the sender substrate to the transfer substrate, and transfer of the components from the transfer substrate to the receiver substrate. The components can be transferred selectively by means of bonding means and/or debonding means.