Selective Component Transfer via Laser Debonding
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Solution Overview
Problem
Existing methods for transferring components from a sender substrate to a receiver substrate lack the ability to selectively exclude defective components, leading to inefficiencies in the semiconductor industry, particularly in the production of light-emitting diodes.
Innovation Solution
A method and device utilizing a transfer substrate with bonding and debonding means, such as lasers, to selectively transfer components by fixing or releasing them individually, ensuring only functional components are transferred, with alignment and testing processes to ensure precise positioning and functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional transfer methods are used to move components from sender substrate to receiver substrate, then the transfer process is simple and fast, but defective components cannot be excluded and are transferred along with functional components
Solution Approach 1:
The transfer process is segmented into distinct phases: bonding phase where functional components are selectively bonded to the transfer substrate, and debonding phase where components are released. This segmentation allows for selective transfer based on component functionality while maintaining process efficiency.
Solution Approach 2:
A transfer substrate is introduced as an intermediary carrier between the sender substrate and the receiver substrate. This intermediate medium enables selective bonding and debonding operations, allowing functional components to be transferred while defective components remain on the sender substrate.
2Productivity
If all components are transferred without selection, then the transfer process is efficient and simple, but defective components are transferred reducing product quality
Solution Approach 1:
Bonding means are activated in advance to selectively bond functional components to the transfer substrate before the transfer operation. This preliminary selective bonding ensures that only functional components are transferred, maintaining both high productivity and component quality.
Solution Approach 2:
The system incorporates feedback mechanisms where bonding and debonding operations are controlled based on component characteristics. This feedback control enables selective transfer of functional components while excluding defective ones, maintaining high transfer efficiency and product quality simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the selective transfer of functional components, reducing defective products and improving production efficiency by ensuring only working components are moved from the sender to the receiver substrate, enhancing the semiconductor industry's component transfer processes.
Implementation Method 1
the adhesive area is heated by means of a laser, in particular by laser radiation incident from the rear side of the substrate
Implementation Method 2
heated by means of a laser, in particular by laser radiation incident from the rear side of the substrate, until the adhesive melts
Implementation Method 3
the adhesive area is heated by means of a laser, in particular by laser radiation incident from the rear side of the substrate
Data Source
AI summary
A method for the transfer of components from a sender substrate to a receiver substrate includes provision and/or production of the components on the sender substrate, transfer of the components of the sender substrate to the transfer substrate, and transfer of the components from the transfer substrate to the receiver substrate. The components can be transferred selectively by means of bonding means and/or debonding means.