SMT Panel Frame With Selective Copper Regions for Reduced Copper Wastage
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Solution Overview
Problem
Conventional SMT panel frames utilize copper extensively without strategic placement, leading to inefficiencies, increased production costs, and environmental waste due to excessive copper removal during de-paneling.
Innovation Solution
The SMT panel frame is designed with selectively arranged copper material regions aligned with Data Matrix Codes, fiducials, and test points, allowing for targeted copper usage through etching or cutting processes to minimize waste and optimize copper placement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If copper material is used extensively throughout the entire panel, then the panel provides sufficient electrical connectivity and structural support, but copper wastage increases and production costs rise
Solution Approach 1:
The patent applies local quality by selectively placing copper material only in specific regions where it is functionally required (signal transmission areas, connection points, component mounting zones) rather than uniformly across the entire panel. This localized copper placement maintains necessary electrical connectivity while eliminating wastage in non-essential areas.
Solution Approach 2:
The patent segments the panel into distinct functional zones with different copper requirements. High-copper areas are concentrated around signal paths and connection points, while low-copper or copper-free areas are designated for non-conductive purposes. This segmentation allows optimized copper distribution that reduces overall material usage.
2Strength
If copper material is placed throughout the entire panel, then the panel structure is robust and provides uniform support, but material costs and environmental impact increase
Solution Approach 1:
The patent applies local quality by varying copper material distribution according to local structural requirements. High-stress areas receive adequate copper reinforcement, while low-stress areas use minimal or no copper. This localized approach maintains necessary structural strength while reducing overall copper consumption and environmental impact.
3Productivity
If conventional de-paneling methods are used to separate individual PCBs, then the separation process is simple and efficient, but excessive copper material is trimmed away and wasted
Solution Approach 1:
The patent applies preliminary action by pre-configuring the copper material layout on the panel before the de-paneling process. Copper is strategically placed in isolated regions that correspond to individual PCB locations, allowing clean separation without generating excessive copper trimmage. This preliminary optimization of material placement prevents wastage during the subsequent separation process.
Data Source
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AI summary
The present invention provides a Surface Mount Technology (SMT) panel frame. The SMT panel frame (100) includes a panel (110) and atleast one copper material region (130) arranged on the panel (110). The panel (110) is substantially enough to securely hold atleast one printed circuit board (120), the panel (110) being removably arranged around the printed circuit board (120), wherein a predefined region on the printed circuit board (PCB) (120) is designated for the placement of Data Matrix Codes (DMC), fiducials and test points. The atleast one copper material region (130) selectively arranged within the panel (110) based on the placement of Data Matrix Codes, fiducials, and test points, such that the copper material regions align with the position and placement of panel fiducials, DMC and the test points thereby reducing the requirement of copper throughout the panel (110).