Selective Cover Lifting for Substrate Processing Maintenance

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Solution Overview

Problem

Horizontal batch type substrate processing apparatuses face challenges in maintenance and repair due to their heavy weight and complex design, which affects safety and productivity.

Innovation Solution

A substrate processing apparatus with a lifting device that selectively lifts first and second covers, allowing for efficient and safe maintenance and repair operations by connecting or disconnecting them via a connection region, and using a method that balances internal and external pressures to facilitate lifting.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If horizontal batch type substrate processing apparatuses are designed to process multiple substrates simultaneously, then productivity is improved, but the apparatus weight and complexity increase, making maintenance and repair difficult

Engineering Contradiction:
Improvesubstrate processing capacityVSAvoidmaintenance accessibility
Core Design Contradiction:
ProductivityVSEase of repair

Solution Approach 1:

The chamber is divided into an upper chamber and a lower chamber that can be separately lifted and accessed. The lifting device enables independent access to each chamber section, allowing maintenance personnel to work on one chamber while the other remains operational, thus maintaining productivity while improving ease of repair.

Inventive Principle:
Principle #1Segmentation

2Manufacturing precision

If the apparatus is designed with heavy components for simultaneous substrate processing, then manufacturing precision and structural stability are improved, but safety risks during maintenance increase

Engineering Contradiction:
Improvesubstrate processing precisionVSAvoidsafety risks during maintenance
Core Design Contradiction:
Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The lifting device enables dynamic reconfiguration of the chamber structure during maintenance. Heavy components can be safely lifted and positioned only when needed for processing, and lowered or isolated during maintenance operations, reducing safety risks while preserving manufacturing precision during normal operation.

Inventive Principle:
Principle #15Dynamics

3Productivity

If the chamber structure is made complex to accommodate multiple substrates, then productivity is improved, but device complexity increases, affecting ease of operation and maintenance

Engineering Contradiction:
Improvebatch processing capabilityVSAvoidchamber structure complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The complex chamber structure is segmented into modular upper and lower chambers that can be independently accessed and maintained. This modular design reduces operational complexity by allowing targeted maintenance on specific sections without requiring disassembly of the entire complex structure.

Inventive Principle:
Principle #1Segmentation

4Strength

If traditional maintenance methods are used on heavy apparatuses, then structural integrity is maintained, but maintenance time increases, reducing productivity

Engineering Contradiction:
Improveapparatus structural integrityVSAvoidmaintenance downtime
Core Design Contradiction:
StrengthVSLoss of time

Solution Approach 1:

The lifting device is pre-installed and can quickly elevate chambers to maintenance position without requiring complex disassembly. This preliminary preparation enables rapid access to chamber components, significantly reducing maintenance downtime while maintaining structural integrity through controlled lifting operations.

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS11205585B2Substrate processing apparatus and method of operating the same
Publication Date: 2021.12.21 ASM IP HLDG BV
  • US11205585B2 patent drawing
  • US11205585B2 patent drawing
  • US11205585B2 patent drawing

AI summary

Provided is a substrate processing apparatus in which parts are selectively lifted according to the purpose or subject of maintenance/repair during a maintenance/repair operation. The substrate processing apparatus includes: a chamber; a first cover and a second cover on the chamber; a lifting device connected to the first cover and configured to raise and lower the first cover; and a connection region. When the lifting device and the second cover are connected to each other via the connection region or the first and second covers are connected to each other via the connection region, the first and second covers are raised and lowered by the lifting device.