Selective Deposition Pretreatment for Removable Blocking Layers
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Solution Overview
Problem
Current selective deposition methods face challenges in removing self-assembled monolayers (SAMs) from metal surfaces to facilitate subsequent deposition processes, which can hinder the effectiveness of barrier films in reducing via resistance, especially in smaller CD features.
Innovation Solution
A surface pretreatment is applied to modify the first surface of a substrate, followed by the formation of a blocking layer using a blocking compound, which is then selectively deposited and later removed to enable controlled deposition on non-metallic surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a self-assembled monolayer (SAM) is used to inhibit nucleation and growth of barrier film on metal surface, then deposition inhibition is improved, but removal of SAM for later deposition becomes difficult
Solution Approach 1:
A surface pretreatment step is performed before applying the blocking compound to modify the metal surface. This preliminary modification enables the blocking layer to be easily removed later without compromising its ability to inhibit deposition during the critical phase, thus resolving the contradiction between effective blocking and easy removal
Solution Approach 2:
The surface properties are changed through pretreatment modification, which alters how the blocking compound interacts with the metal surface. This parameter change allows the blocking layer to form with appropriate adhesion for inhibition but with modified characteristics that facilitate subsequent removal, addressing both requirements simultaneously
2Reliability
If strong interaction between SAM and metal surface is used to prevent deposition, then deposition inhibition is improved, but SAM removal becomes an obstacle
Solution Approach 1:
The metal surface is pretreated before applying the blocking compound to create a modified surface that enables controlled interaction. This preliminary action ensures strong enough binding for effective blocking but with surface characteristics that facilitate later removal, thus resolving the contradiction between strong interaction for prevention and ease of removal
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method allows for the effective removal of the blocking layer without adversely affecting the substrate, thereby improving via resistance and enabling precise deposition on non-metallic surfaces, such as dielectric materials.
Implementation Method 1
exposing a substrate comprising a first material with a first surface and a second material with a second surface to a surface pretreatment to modify the first surface and form a modified first surface
Implementation Method 2
The substrate is exposed to a blocking compound to selectively form a blocking layer on the modified first surface
Implementation Method 3
The blocking layer is removed from the first material. The surface pretreatment facilitates the removal of the blocking layer from the first surface
Data Source
AI summary
Methods of surface pretreatment during selective deposition are disclosed. One or more embodiment of the disclosure provides surface pretreatments which facilitate the removal of blocking layers. Some embodiments of the disclosure include a surface pretreatment comprising exposure of a substrate with a first surface and a second surface to modify the first surface, a blocking layer is deposited on the modified first surface, a film is selectively deposited on the second surface over the blocking layer, and the blocking layer is removed.