Selective Deposition Using Hydrophilic Polymer Inhibitors
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Solution Overview
Problem
Traditional deposition methods for electronic devices, such as photolithography and vacuum processing, face challenges with flexible substrates like plastics, which are limited by temperature, solvent resistance, and dimensional stability, and require expensive equipment and organic solvents, making them unsuitable for large-scale, cost-effective manufacturing.
Innovation Solution
A method using a hydrophilic polymer as a deposition inhibitor, soluble in aqueous solutions, is applied to a substrate to inhibit deposition in unwanted areas, allowing for selective atomic layer deposition of inorganic thin films using a spatially dependent ALD process at atmospheric pressure, eliminating the need for organic solvents and enabling deposition on large, flexible substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional photolithography and vacuum processing are used, then deposition can be achieved, but the process requires expensive equipment and organic solvents, and is unsuitable for large-scale manufacturing
Solution Approach 1:
The patent replaces vacuum-based mechanical deposition systems with atmospheric pressure chemical vapor deposition (CVD). This substitution eliminates the need for expensive vacuum chambers and pumping systems, allowing deposition to occur at atmospheric pressure using simple flow reactors, thereby dramatically reducing equipment costs while enabling large-scale manufacturing of flexible electronics
Solution Approach 2:
The patent changes the operating pressure parameter from vacuum to atmospheric pressure, and replaces organic solvent-based processes with aqueous-based processes. This parameter change enables the use of simpler equipment and more environmentally friendly, cost-effective materials while maintaining deposition quality on flexible substrates
2Manufacturing precision
If traditional photolithography is used on flexible substrates, then patterning can be achieved, but the substrate's maximum process temperature, solvent resistance, and dimensional stability limit the process
Solution Approach 1:
The patent replaces photolithography with a direct atmospheric pressure CVD approach that uses aqueous precursor solutions. This substitution eliminates the need for high-temperature processing and organic photoresist solvents, allowing patterning to be achieved on flexible substrates at low temperatures while maintaining manufacturing precision through controlled deposition
Solution Approach 2:
The patent changes the processing temperature parameter from high temperature (required for traditional photolithography) to low temperature (compatible with flexible substrates). It also changes the solvent parameter from organic to aqueous, enabling patterning processes that respect the thermal and chemical constraints of flexible substrates while achieving the required manufacturing precision
3Quantity of substance
If vacuum deposition is used, then thin films can be deposited, but much of the deposited material is removed in photolithography, resulting in material waste
Solution Approach 1:
The patent replaces vacuum deposition followed by photolithographic removal with atmospheric pressure CVD that deposits material directly in the desired pattern. This substitution eliminates the wasteful process of depositing material everywhere and then removing it, thereby improving material deposition efficiency and reducing substance loss
Solution Approach 2:
The patent applies deposition inhibitor materials to the substrate before deposition to pre-pattern the surface. This preliminary action ensures that material is deposited only where desired from the beginning, eliminating the need for subsequent removal steps and preventing material waste
4Manufacturing precision
If deposition inhibitor materials soluble in organic solvents are used, then selective deposition can be achieved, but the process requires organic solvents which increase cost and environmental concerns
Solution Approach 1:
The patent changes the solvent parameter from organic to aqueous for deposition inhibitor materials. This substitution maintains the selective deposition capability through the same mechanism (polymer adsorption inhibition) while eliminating the need for expensive and environmentally problematic organic solvents, thereby improving ease of manufacture and reducing environmental impact
Solution Approach 2:
The patent uses water-soluble polymer deposition inhibitors that can be easily applied and removed with water. These inexpensive, water-soluble materials replace costly organic solvent-based inhibitors, making the selective deposition process more economically viable and environmentally friendly without sacrificing precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of patterned thin films on flexible substrates with improved performance and cost-effectiveness by allowing deposition only in desired areas, reducing material waste and operational costs, and accommodating larger substrate sizes.
Implementation Method 1
a composition comprising a deposition inhibitor material is applied to a substrate... depositing an inorganic thin film on the substrate by chemical vapor deposition only in those areas where the deposition inhibitor material is absent
Implementation Method 2
the deposition inhibitor material is a hydrophilic polymer that is soluble in an aqueous solution that comprises at least 50% by weight of water
Implementation Method 3
depositing an inorganic thin film on the substrate by chemical vapor deposition only in those areas where the deposition inhibitor material is absent
Data Source
AI summary
A chemical vapor deposition method such as an atomic-layer-deposition method for forming a patterned thin film includes applying a deposition inhibitor material to a substrate. The deposition inhibitor material is a hydrophilic polymer that is soluble in an aqueous solution comprising at least 50 weight % water and has an acid content of less than 2.5 meq/g of polymer. The deposition inhibitor material is patterned simultaneously or subsequently to its application to the substrate, to provide selected areas of the substrate effectively not having the deposition inhibitor material. A thin film is substantially deposited only in the selected areas of the substrate not having the deposition inhibitor material.