Selective-Electroplating Epoxy for Fine Pitch Substrates
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Solution Overview
Problem
Current package substrate manufacturing processes are complex and costly, with challenges in forming patterned circuit layers with fine pitch and achieving reduced thickness due to the use of polyimide or Ajinomoto build-up film (ABF) resins and silicon insulation substrates, which are brittle and require intricate processing.
Innovation Solution
A package substrate structure utilizing a selective-electroplating epoxy compound with non-conductive metal complexes, allowing for direct electroplating of patterned circuit layers and conductive vias, enabling simplified manufacturing and flexible design with reduced thickness, and meeting fine pitch standards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If polyimide or ABF resin insulation substrates are used, then circuit layers can be formed, but the manufacturing process becomes complicated and cost increases
Solution Approach 1:
The patent extracts the copper plating function from the traditional multi-step sputtering and plating process by incorporating non-conductive metal complexes directly into the epoxy compound matrix. This allows the epoxy to serve both as insulation and as a copper-containing layer that can be selectively plated, eliminating separate copper deposition steps and simplifying the manufacturing process.
Solution Approach 2:
The patent merges the insulation function and the copper source function into a single epoxy compound layer. By incorporating non-conductive metal complexes (copper precursors) into the epoxy matrix, the material simultaneously provides electrical insulation and serves as a copper reservoir for selective electroplating, reducing the number of separate material layers and process steps.
2Manufacturing precision
If silicon insulation substrates are used, then circuit density can be increased, but the substrate thickness cannot be reduced due to structural brittleness
Solution Approach 1:
The patent changes the material parameters by replacing traditional polyimide or ABF resins with an epoxy compound containing non-conductive metal complexes. This material substitution enables thinner substrate design while maintaining structural integrity and enabling fine pitch circuit formation, as the epoxy-copper complex provides both mechanical support and copper deposition capability in a single integrated layer.
3Manufacturing precision
If traditional sputtering and plating processes are used, then circuit layers can be formed, but manufacturing cost increases
Solution Approach 1:
The patent extracts the copper deposition function from expensive sputtering equipment and processes by using selective electroplating on the epoxy-copper complex. This approach uses more cost-effective electroplating technology instead of costly sputtering, while achieving the same circuit layer formation result through the selective reduction of copper ions from the non-conductive metal complexes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the formation of patterned circuit layers and conductive vias through direct electroplating, simplifying the manufacturing process, reducing overall thickness, and offering flexibility in circuit design while meeting fine pitch requirements, thus addressing the complexity and cost issues of existing methods.
Implementation Method 1
forming patterned circuit layers by directly electroplating a selective-electroplating epoxy compound thereof
Data Source
AI summary
A package structure includes a selective-electroplating epoxy compound, a first patterned circuit layer, second patterned circuit layers, metal studs, contact pads and conductive vias. The selective-electroplating epoxy compound includes cavities, a first surface and a second surface. The cavities disposed on the first surface in array arrangement. The selective-electroplating epoxy compound is formed by combining non-conductive metal complex. The metal studs are disposed in the cavities respectively and protruded from the first surface. The first patterned circuit layer is directly disposed on the first surface. The selective-electroplating epoxy compound exposes a top surface of the patterned circuit layer. The top surface is lower than or coplanar with the first surface. The second patterned circuit layers are directly disposed on the second surface. The conductive vias are disposed at the selective-electroplating epoxy compound to electrically connect the second patterned circuit layers to the corresponding metal studs.