Selective EMI Shielding Ink Printing Without Vacuum Sputtering
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Solution Overview
Problem
Existing selective electromagnetic shielding methods, such as selective sputtering, are lengthy, require multiple auxiliary materials and equipment, and harsh environmental conditions, leading to process risks and quality issues.
Innovation Solution
A pad printing method is used to apply electromagnetic shielding ink on selective areas of an electronic packaging module, forming shielding layers through curing, with multiple printing steps and customized printing plates to ensure complete coverage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If selective sputtering process is used, then electromagnetic shielding can be achieved, but the process becomes lengthy and complex requiring taping and debonding
Solution Approach 1:
The patent extracts and removes the complex taping and debonding steps from the sputtering process, replacing them with a direct printing method that applies electromagnetic shielding ink only to required areas without auxiliary masking materials
Solution Approach 2:
The patent replaces the mechanical sputtering deposition process with a printing-based application method, substituting the complex vacuum-based mechanical system with a simpler ink deposition and curing system
2Reliability
If selective sputtering process is used, then electromagnetic shielding can be achieved, but a large number of auxiliary materials are required
Solution Approach 1:
The patent completely removes auxiliary materials such as carrier tape, mask tape, and support tape from the process, using only the essential electromagnetic shielding ink and printing plate
Solution Approach 2:
The patent replaces expensive and complex auxiliary materials with a simple, disposable printing plate that can be easily manufactured and discarded after use, significantly reducing material consumption and cost
3Reliability
If selective sputtering process is used, then electromagnetic shielding can be achieved, but vacuum conditions and harsh environmental requirements are needed
Solution Approach 1:
The patent replaces the vacuum-based sputtering system with a printing and curing system that operates under normal atmospheric conditions, eliminating the need for vacuum chambers and harsh environmental controls
Solution Approach 2:
The patent changes the operating parameters from vacuum conditions (−3 Torr) to atmospheric pressure, and from low temperature sputtering to elevated temperature curing, making the process compatible with standard manufacturing environments
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces auxiliary material use, lowers costs, simplifies the process, eliminates vacuum requirements, and promotes environmentally friendly practices while achieving effective electromagnetic shielding.
Implementation Method 1
curing the electromagnetic shielding ink of the first area to form an electromagnetic shielding layer
Data Source
AI summary
The present application provides a preparation method for a selective electromagnetic shielding and an electronic product thereof, the method comprising: printing electromagnetic shielding ink on a first area on a surface of an electronic packaging module by pad printing, wherein the first area is an area requiring electromagnetic shielding; curing the electromagnetic shielding ink to form an electromagnetic shielding layer. Compared with the existing selective sputtering process, the present application reduces the use of auxiliary materials, reduces costs, has a simple and stable process, does not require vacuum conditions, and promotes low-carbon and environmentally friendly practices.