Selective Encapsulation of Electronic Packages Using Dam Filling

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Solution Overview

Problem

Conventional encapsulation methods in electronic package modules interfere with the operation of sensitive components like optical components and connectors, making them unsuitable for use.

Innovation Solution

A method involving a dam and filling process with a sacrificial layer is used to form dual-side encapsulation, allowing selective encapsulation of electronic components while providing a metal shield for protection against electromagnetic interference.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional encapsulation is applied to all electronic components, then protection and encapsulation are improved, but operation of sensitive components such as optical components and connectors is interfered with

Engineering Contradiction:

Improveencapsulation protectionVSAvoidcomponent operation

Core Design Contradiction:

ReliabilityVSEase of operation

Solution Approach 1:

The patent applies different treatments to different regions of the circuit board: encapsulation is applied only to regions containing electronic components that require protection, while regions containing optical components and connectors are left unencapsulated to maintain their operational functionality. This selective encapsulation approach resolves the contradiction by making the encapsulation property local rather than universal.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The circuit board is divided into multiple regions: first encapsulation region, second encapsulation region, and predetermined regions (which remain unencapsulated). The dam structures further segment these regions to control the flow and boundaries of encapsulation material. This segmentation enables selective encapsulation of only those areas requiring protection while preserving operational areas.

Inventive Principle:

Principle #1Segmentation

2Ease of operation

If selective encapsulation is implemented, then operation of sensitive components is preserved, but manufacturing complexity increases due to dam and filling process

Engineering Contradiction:

Improvecomponent operationVSAvoidmanufacturing process

Core Design Contradiction:

Ease of operationVSDevice complexity

Solution Approach 1:

Dam structures are introduced as intermediary elements to control the boundaries and flow of encapsulation material. These dams act as mediators between the encapsulation regions and predetermined regions, enabling precise control over where encapsulation occurs without requiring complex masking or selective application processes. The dams simplify the manufacturing by providing a physical barrier that naturally guides material flow.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The dam structures are formed in advance before the encapsulation filling process. This preliminary action of creating physical barriers allows the encapsulation material to be applied in a single continuous filling operation, rather than requiring multiple separate application steps. The preliminary formation of dams reduces manufacturing complexity by enabling a simplified sequential process.

Inventive Principle:

Principle #10Preliminary action

3Object-affected harmful factors

If metal shield layer is added for EMI protection, then electromagnetic interference protection is improved, but manufacturing steps and process complexity increase

Engineering Contradiction:

Improveelectromagnetic interference protectionVSAvoidmanufacturing steps

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The metal shield layer formation is merged with the existing encapsulation process. The same dam structures that control encapsulation material flow are also used to control metal shield material flow. The encapsulation filling and metal shield deposition are combined into a single integrated process step, reducing the total number of manufacturing steps while achieving both encapsulation and EMI protection.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The dam structures serve multiple functions: they control the boundaries of encapsulation regions, guide the flow of encapsulation material, and simultaneously control the deposition of metal shield material. This multi-functionality reduces the need for separate control mechanisms for each process, thereby reducing overall manufacturing complexity while achieving both encapsulation and EMI protection.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables the encapsulation of electronic components without affecting their operation and provides effective protection against electromagnetic interference, ensuring the functionality of sensitive components like CMOS image sensors and connectors.

Implementation Method 1

The first dam structure and the second dam structure are made of photo-curable metal glue

Methodology Applied

Scientific EffectPhotopolymerization: Photopolymerisation

Data Source

PatentUS9105613B1Method of manufacturing electronic package module and electronic package module manufactured by the same

Publication Date: 2015.08.11 ADVANCED SEMICON ENG INC

AI summary

A method of manufacturing an electronic package module is provided. The method forms dual-side and selective encapsulation by using a dam filling process and a sacrificial layer. Electronic components are protected from electromagnetic interference while not interfering functioning of specific electronic components which are not encapsulated.