Selective Film Formation via Liquid Precursor and Stepped Substrate

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing film forming methods struggle to selectively form films on specific regions of a substrate where different materials are exposed, as they often result in unwanted product formation and lack precision in material distribution.

Innovation Solution

A film forming method that involves preparing a substrate with distinct regions, forming a stepped portion to differentiate the regions, supplying a liquid to the substrate, and using a processing gas to chemically change the liquid, causing it to move from one region to another, thereby selectively forming a film on the desired region.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a processing gas is supplied to a substrate with different material regions to selectively form a film, then film formation precision is improved, but unwanted products are generated in regions where selective formation should not occur

Engineering Contradiction:
Improvefilm formation precisionVSAvoidunwanted product generation
Core Design Contradiction:
Manufacturing precisionVSObject-generated harmful factors

Solution Approach 1:

A liquid precursor is introduced as an intermediary substance that selectively wets only the intended formation region on the substrate. This liquid precursor then reacts with the processing gas to form the desired film. The liquid acts as a mediator that prevents the processing gas from directly reacting with materials in regions where film formation should not occur, thereby eliminating unwanted product generation while maintaining high film formation precision.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The liquid precursor is supplied to the substrate before the processing gas is introduced. This preliminary action of wetting the substrate surface with the liquid precursor in the intended formation region creates a controlled reaction zone. When the processing gas is subsequently supplied, it only reacts with the liquid precursor in the pre-defined region, preventing unwanted reactions in other areas and enabling precise film formation.

Inventive Principle:
Principle #10Preliminary action

2Ease of manufacture

If conventional film forming methods are used on substrates with different material regions, then processing simplicity is maintained, but selective film formation cannot be achieved

Engineering Contradiction:
Improveprocessing simplicityVSAvoidselective film formation capability
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The liquid precursor serves as a spatial selector that enables conventional processing equipment to achieve selective film formation. By introducing this liquid intermediary that selectively wets specific regions, the method maintains the simplicity of conventional film forming processes while adding the capability for precise selective film formation on substrates with different material regions.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The method changes the physical state and distribution parameters of the reactants by introducing a liquid precursor that selectively wets specific regions. This parameter change from gaseous-only reactants to liquid-gas combination enables spatial selectivity while maintaining process simplicity, as the liquid precursor can be easily deposited and controlled in the intended formation regions.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method allows for precise and selective film formation on specific regions of the substrate, enhancing control over film deposition and preventing unwanted product generation, thus improving the accuracy and efficiency of the film forming process.

Implementation Method 1

supplying a processing gas that chemically changes the liquid, to the surface

Methodology Applied
Scientific EffectChemical reaction: Chemical Bonding

Implementation Method 2

moving the liquid from the second region to the first region by a reaction between the processing gas and the liquid

Methodology Applied
Scientific EffectCapillary action: Capillary Action

Data Source

PatentUS20240263306A1Film forming method and film forming device
Publication Date: 2024.08.08 TOKYO ELECTRON LTD
  • US20240263306A1 patent drawing
  • US20240263306A1 patent drawing
  • US20240263306A1 patent drawing

AI summary

A film forming method includes: (A) preparing a substrate with a surface having a first region where a first film is exposed, and a second region where a second film formed by a material different from the first film is exposed; (B) forming a stepped portion in the surface such that the first region becomes higher than the second region; (C) supplying a liquid to the surface where the stepped portion is formed; and (D) supplying, to the surface, a processing gas that chemically changes the liquid, and moving the liquid from the second region to the first region by a reaction between the processing gas and the liquid to selectively form a film in the first region with respect to the second region.