Selective Fluidic Head Array for Micro-LED Pick and Place
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional pick and place techniques are unsuitable for transferring small semiconductor devices like micro-LEDs due to their small size, making it difficult to achieve precise and efficient assembly on a target substrate.
Innovation Solution
A fluidic head array with selectively extendable fluidic heads is used to form conformable interface layers on semiconductor devices, allowing for adhesive pick-up and placement on a target substrate, utilizing elastomer solution and piezo actuators to transition between shortened and lengthened states for precise manipulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional pick and place techniques are used, then the assembly process is simple, but the technique is unsuitable for small semiconductor devices due to their small size
Solution Approach 1:
The system divides the pick and place function into multiple fluidic heads arranged in an array, where each head can independently pick up and place individual semiconductor devices. This segmentation allows the system to handle small devices effectively while maintaining overall system functionality through modular operation.
Solution Approach 2:
A conformable interface layer is introduced as an intermediary between the semiconductor devices and the fluidic heads. This layer enables reliable adhesive attachment of small devices to the fluidic heads, solving the problem of handling tiny components that conventional techniques cannot grasp effectively.
2Manufacturing precision
If fluidic head array with selective extension is used, then precise transfer of small semiconductor devices is enabled, but the device complexity increases
Solution Approach 1:
The fluidic heads incorporate extendable actuators that can dynamically change the length of each head independently. This dynamic adjustment capability allows precise positioning of fluidic tips to match the locations of semiconductor devices on the carrier substrate, enabling high-precision transfer while maintaining selective operation.
Solution Approach 2:
The system changes the physical state and position parameters of the fluidic heads by extending or retracting actuators based on the specific locations where semiconductor devices need to be picked up. This parameter adjustment enables precise control over which devices are transferred and where they are placed.
3Ease of operation
If elastomer solution is applied to form conformable interface layers, then adhesive pick and place is facilitated, but the manufacturing process becomes more complex
Solution Approach 1:
The conformable interface layer is formed on the semiconductor devices before the pick and place operation. This preliminary action ensures that the adhesive layer is already in place and properly conforming to the device surface, making the subsequent pickup operation straightforward and reliable without requiring complex real-time adjustments.
Solution Approach 2:
The elastomer solution automatically forms a conformable interface layer that adapts to the shape and surface characteristics of each semiconductor device. This self-conforming property eliminates the need for precise manual alignment or complex positioning mechanisms, as the adhesive layer naturally adjusts to ensure proper contact.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient and precise transfer of small semiconductor devices, such as micro-LEDs, onto a target substrate, facilitating the assembly of sub-pixels in display devices with reduced manufacturing time and cost.
Implementation Method 1
the fluidic head actuator of each of the fluidic heads includes a piezo layer. A voltage is applied to the fluidic head actuator in a direction of polarization the piezo layer to extend the fluidic head actuator.
Implementation Method 2
transfer the elastomer solution on the fluidic tips of the fluidic heads to semiconductor devices on a carrier substrate to form conformable interface layers on the semiconductor devices. pick up the semiconductor devices via adhesive attachment with the conformable interface layers
Data Source
AI summary
A method and system for manufacturing a device by forming a conformable interface layer from elastomer solution on semiconductor devices to facilitate picking and placing the semiconductor devices from a carrier substrate to a target substrate. The method may include transferring elastomer solution onto fluidic tips of a subset of fluidic heads of a fluidic head array by extending one or more fluidic head actuators of the subset of the fluidic heads, transferring the elastomer solution on the fluidic tips of the subset of the fluidic heads to semiconductor devices on a carrier substrate to form conformable interface layers on the semiconductor devices, and picking up the semiconductor devices via adhesive attachment with the conformable interface layers from the carrier substrate to place on a target substrate.