Selective MLD Sacrificial Film Deposition for Fine Patterning

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Solution Overview

Problem

The increasing integration and miniaturization of semiconductor devices require an economical and simplified patterning process to implement fine patterns, which existing technologies struggle to achieve without separate pretreatment processes.

Innovation Solution

A film deposition method using molecular layer deposition (MLD) to selectively form a thick polymer film on surfaces with high functional group density by forming a thermally decomposable polymer sacrificial layer on one surface and a first film on an adjacent surface with lower functional group density, allowing for controlled thickness and pattern formation without additional pretreatment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If conventional deposition methods are used to form polymer films, then film formation is achieved, but separate pretreatment processes are required and manufacturing complexity increases

Engineering Contradiction:
Improveprocess simplificationVSAvoidpretreatment process complexity
Core Design Contradiction:
Ease of manufactureVSDevice complexity

Solution Approach 1:

The substrate surfaces are designed to inherently differentiate between first and second surfaces through functional group density variations. The MLD process automatically deposits polymer films only on surfaces with sufficient functional group density, eliminating the need for external pretreatment processes to prepare specific areas for deposition.

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The substrate is engineered with non-uniform surface properties where the first surface has high functional group density and the second surface has low functional group density. This local quality difference enables selective polymer film formation on specific regions without requiring additional pretreatment steps.

Inventive Principle:
Principle #3Local quality

2Manufacturing precision

If selective polymer film formation is achieved through surface differentiation, then pattern formation quality improves, but process time increases due to multiple deposition and removal cycles

Engineering Contradiction:
Improvepattern formation qualityVSAvoidmanufacturing time
Core Design Contradiction:
Manufacturing precisionVSLoss of time

Solution Approach 1:

The polymer sacrificial layer is designed to undergo thermal decomposition at specific temperature ranges. By controlling the deposition and removal processes through temperature phase transitions, the method achieves high-quality pattern formation while minimizing the number of process cycles required, thereby reducing overall manufacturing time.

Inventive Principle:
Principle #36Phase transitions

3Manufacturing precision

If thick polymer films are formed selectively on high functional group density surfaces, then film thickness control improves, but process cost increases due to specialized MLD equipment

Engineering Contradiction:
Improvefilm thickness controlVSAvoidprocess cost
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The method utilizes changes in functional group density as a critical parameter to control polymer film deposition. By adjusting substrate surface chemistry rather than requiring complex equipment modifications, the process achieves precise film thickness control while maintaining cost-effectiveness through standard MLD equipment.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enables the formation of high-quality patterns with reduced process costs and time, while selectively forming thick polymer films on surfaces with high functional group density, thereby simplifying the semiconductor manufacturing process.

Implementation Method 1

forming a polymer sacrificial layer on the first surface by using a molecular layer deposition (MLD) process

Methodology Applied
Scientific EffectChemical Vapour Deposition: Chemical Vapour Deposition

Implementation Method 2

the precursor includes an electrophile and a compound that reacts with the electrophile to form the thermally decomposable polymer

Methodology Applied
Scientific EffectChemical Bonding: Chemical Bonding

Implementation Method 3

removing the polymer sacrificial layer formed on the first surface, wherein the polymer sacrificial layer includes a thermally decomposable polymer

Methodology Applied
Scientific EffectThermal decomposition: Pyrolysis

Data Source

PatentUS20240429039A1Method of depositing film
Publication Date: 2024.12.26 SAMSUNG ELECTRONICS CO LTD
  • US20240429039A1 patent drawing
  • US20240429039A1 patent drawing
  • US20240429039A1 patent drawing

AI summary

Methods of depositing a film are provided. The methods may include providing a substrate that includes a first surface and a second surface adjacent to the first surface; forming a polymer sacrificial layer on the first surface by using a molecular layer deposition (MLD) process; forming a first film on the second surface; and removing the polymer sacrificial layer formed on the first surface. A functional group density of the first surface may be higher than a functional group density of the second surface, and the polymer sacrificial layer may include a thermally decomposable polymer.