Selective Molding of Electronic Package Modules Using Tape Masks
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Solution Overview
Problem
Existing electronic package modules often encapsulate optical components with molding, which can impair their operation, and existing methods lack the ability to selectively avoid molding over these components.
Innovation Solution
A method involving a circuit substrate with a mountable surface and patterned regions, where tape is applied over specific areas to prevent molding, allowing for selective removal of molding using techniques like laser-scribing or heat, thereby enabling the placement of optical components without encapsulation and providing EMI shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If molding compound is used to encapsulate electronic components for protection, then reliability is improved, but optical components cannot operate normally due to encapsulation
Solution Approach 1:
The circuit substrate is divided into a moldable region and a non-moldable region, with optical components specifically placed in the non-moldable region. This segmentation allows molding compound to protect electronic components in the moldable region while leaving optical components exposed in the non-moldable region, resolving the contradiction between protection and operational functionality.
2Object-affected harmful factors
If selective molding is implemented to avoid optical components, then optical component operation is preserved, but manufacturing process complexity increases
Solution Approach 1:
Optical components are mounted on the circuit substrate before the molding process. This preliminary action allows the molding compound to be applied selectively only to non-moldable regions, automatically avoiding optical components without requiring complex real-time adjustments or additional masking steps during molding.
Solution Approach 2:
The circuit substrate is designed with distinct moldable and non-moldable regions, where only specific areas receive molding compound. This local quality approach allows standard molding processes to be used while achieving selective coverage, avoiding the need for complex universal molding solutions.
3Object-generated harmful factors
If molding is applied over the entire circuit substrate, then EMI shielding is provided, but optical components are encapsulated and cannot function
Solution Approach 1:
The circuit substrate is segmented into moldable and non-moldable regions, allowing molding compound to provide EMI shielding in the moldable region while leaving optical components in the non-moldable region exposed and functional.
Solution Approach 2:
EMI shielding through molding is applied locally only to regions where electronic components are present, rather than uniformly across the entire substrate. This local application provides necessary shielding while preserving optical component functionality in non-moldable regions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for selective molding only where needed, preventing encapsulation of optical components and providing EMI shielding without complex processes, ensuring normal operations and protecting sensitive components.
Implementation Method 1
laser-scribing at least one groove correspondingly to the patterned predetermined region on the molding above the ground pad
Implementation Method 2
heat is provided to facilitate the removal of the tape
Implementation Method 3
the tape is radiated by ultraviolet rays to remove the tape
Data Source
AI summary
A method of manufacturing electronic package module is provided. The method provides selective molding by attaching tapes on the circuit substrate on which electric components are mounted thereon, forming molding compound to cover the circuit substrate, and removing tapes along with the molding compound thereon.