Selective Punch Separation of Electronic Components From Frames
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Solution Overview
Problem
Current methods for processing electronic components are limited in capacity and require high investments in machine capacity, with a separate selection process that is not integrated with the separation process, leading to inefficiencies and potential disruptions in subsequent processing steps due to inadequate or low-quality components.
Innovation Solution
A device with displaceable press parts, individually controlled punches, and an intelligent control system that integrates selection and separation, allowing for precise positioning and sorting of electronic components based on quality, enabling efficient separation and sorting of electronic components directly from a frame, reducing the need for subsequent selection steps and improving processing capacity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a separate selection process is used after separation, then quality control is maintained, but processing capacity is limited and lead time increases
Solution Approach 1:
The patent combines the selection function and separation function into a single integrated device. The selection means identifies defective components while the separation means simultaneously removes them from the frame during the same operational cycle, eliminating the need for sequential separate selection and separation processes. This integration directly increases processing capacity and reduces lead time by performing multiple functions in parallel rather than sequentially.
2Manufacturing precision
If individual punch controls are implemented for each punch, then selective separation precision is improved, but device complexity increases
Solution Approach 1:
The patent uses a matrix array of punches where each punch position corresponds to a specific component location on the frame. The selection means creates a digital map or matrix representation of which punches should be activated based on component quality data. This copying approach allows precise control of individual punches while managing complexity through standardized positioning and a systematic control matrix rather than entirely custom control logic for each punch.
3Productivity
If low-quality components are not removed before subsequent processing, then processing continuity is maintained, but quality of subsequent processing deteriorates
Solution Approach 1:
The patent performs selection and removal of defective components before subsequent processing steps occur. The selection means identifies components that would adversely affect later processing operations, and the separation means removes them in advance. This preliminary action ensures that only quality components proceed to subsequent processing, maintaining both processing continuity and high quality outcomes.
Data Source
AI summary
The present invention relates to a device for selective separating electronic components from a frame with electronic components including at least two press parts; drive means for moving the press parts; a guide for guiding frames between the press parts; a plurality of punches in a first press part and a plurality of openings in a second press part. The invention also provides a system for in-line selective separating electronic components from a frame with electronic components and a method for selective separating electronic components from a frame with electronic components.