Selective Resin Coating for Ceramic Electronic Components
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Solution Overview
Problem
Existing ceramic electronic components face increased manufacturing costs and lack positional selectivity in coating due to the need for full-surface glass or resin coating, which complicates the formation of external electrodes and limits the thickness of the coating film.
Innovation Solution
A method of selectively forming a resin-based coating film on the ceramic surface of electronic components using a resin-containing solution that etches and ionizes ceramic elements, allowing for the deposition of these elements and resin only on the ceramic surface, thereby avoiding the need for full-surface coating and enabling cost-effective production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If glass coating is applied over the entire surface of the electronic component, then chemical resistance and mechanical strength are improved, but manufacturing cost increases due to additional firing steps and film removal operations
Solution Approach 1:
The patent applies coating material only to specific regions of the ceramic electronic component where protection is needed, rather than coating the entire surface. This selective application reduces material consumption and eliminates the need for subsequent film removal steps, directly addressing the contradiction between achieving adequate protection and minimizing manufacturing cost.
Solution Approach 2:
The coating process is segmented into selective application zones based on functional requirements. Different regions of the component receive coating treatment according to their specific needs, allowing the patent to achieve necessary chemical resistance and mechanical strength enhancement only where required, thereby reducing overall manufacturing complexity and cost.
2Object-affected harmful factors
If glass coating is applied over the entire surface, then chemical erosion resistance is improved, but positional selectivity is lost requiring additional manufacturing steps
Solution Approach 1:
The invention implements local quality by designing the coating application system to deposit material selectively on specific surfaces or regions of the ceramic component. This approach provides chemical erosion resistance precisely where needed while maintaining a simplified manufacturing process without requiring full-surface coating and subsequent selective removal operations.
3Reliability
If resin coating is applied over the entire surface, then protection against moisture and plating solutions is improved, but manufacturing cost increases due to film removal operations
Solution Approach 1:
The patent applies resin coating material selectively to specific regions of the ceramic electronic component rather than the entire surface. This targeted application provides necessary protection against moisture and plating solutions in critical areas while eliminating the need for costly film removal operations, thus resolving the contradiction between reliability improvement and manufacturing cost reduction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the selective formation of a high-heat-resistant coating film on ceramic electronic components, reducing manufacturing costs and enabling complex or microstructured electrode designs, while maintaining the mechanical strength and chemical resistance of the components.
Implementation Method 1
a resin-containing solution which etches a surface of the ceramic main body to ionize constituent elements of the ceramic main body
Implementation Method 2
etches a surface of the ceramic main body to ionize constituent elements of the ceramic main body
Implementation Method 3
constituent elements of the ceramic main body, which are ionized and deposited from the ceramic main body, are contained in the coating film
Data Source
AI summary
A ceramic electronic component that includes a ceramic main body, a coating film and external electrodes on the surface of the ceramic main body. The coating film is selectively formed on the surface of the ceramic main body by applying, to the surface of the ceramic main body, a resin-containing solution that etches the surface of the ceramic main body so as to ionize constituent elements of the ceramic main body. The coating film includes a resin and the constituent elements of the ceramic main body, which were ionized and deposited from the ceramic main body.