Selective Shielding Material Deposition for EMI and Thermal Balance
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Solution Overview
Problem
Electronic devices face challenges in mitigating electromagnetic interference (EMI), thermal performance, and security due to the need for materials that provide optimal EM shielding and thermal properties, which are often conflicting, leading to inefficiencies and increased costs in identifying and applying appropriate materials.
Innovation Solution
A method and system for generating EM and thermal maps of electronic devices to identify locations requiring EM shielding and thermal materials, using a shielding apparatus to apply materials like Cu, NiFe, and alloys selectively via sputtering or electroplating, balancing EM shielding and thermal performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If EM shielding material is applied to provide electromagnetic shielding, then electromagnetic interference protection is improved, but thermal performance deteriorates
Solution Approach 1:
The patent applies different materials to different locations on the electronic device based on EM maps and thermal maps. EM shielding materials are applied specifically to locations identified as needing electromagnetic protection, while thermally conductive materials are applied to locations requiring heat dissipation. This localized approach allows simultaneous optimization of EM shielding and thermal performance without uniform material application compromising either function.
Solution Approach 2:
The patent utilizes composite material structures where multiple materials with different properties (EM shielding and thermally conductive) are combined in specific configurations. By layering or positioning different materials in composite structures, the system achieves both electromagnetic interference protection and adequate thermal management, resolving the contradiction between these two opposing requirements.
2Object-affected harmful factors
If multiple materials are applied to satisfy both EM shielding and thermal requirements, then protection performance is improved, but manufacturing complexity increases
Solution Approach 1:
The patent generates EM maps and thermal maps during the design phase to pre-identify locations requiring specific materials. This preliminary analysis allows the manufacturing process to follow a predetermined plan, reducing on-the-fly decision-making and complexity. The shielding apparatus receives guidance on exactly where to apply which materials, streamlining the manufacturing process despite the multi-material requirement.
Solution Approach 2:
The patent employs automated shielding apparatus that uses the generated maps to control material application. This automation replaces manual or semi-manual material application processes, reducing human involvement and simplifying the manufacturing workflow. The systematic, map-driven approach to material deposition reduces complexity compared to trial-and-error or experience-based methods.
3Adaptability or versatility
If material application locations are identified after manufacture, then design flexibility is maintained, but productivity decreases
Solution Approach 1:
The patent performs EM mapping and thermal mapping during the design phase, before manufacturing begins. This preliminary identification of material application locations enables the manufacturing process to proceed efficiently with predetermined instructions. The shielding apparatus receives pre-calculated maps that specify exact locations for material application, eliminating post-manufacturing analysis and accelerating production.
Solution Approach 2:
The system uses automated algorithms that generate EM and thermal maps and translate them into manufacturing instructions without requiring manual intervention. This self-service capability streamlines the workflow from design to manufacturing, maintaining design flexibility through automated optimization while significantly improving productivity by eliminating manual material location identification processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Efficiently applies EM shielding and thermal materials to achieve predetermined thresholds, reducing interference and enhancing security while optimizing device performance and lowering costs by identifying optimal material locations before manufacture.
Implementation Method 1
selectively via sputtering or electroplating
Implementation Method 2
selectively via sputtering or electroplating
Data Source
AI summary
A method and system for applying materials to an electronic device may include generating an electromagnetic (EM) map of the device. The EM map may indicate locations of EM radiation emitted from the electronic device. The method may also include generating a thermal map of the electronic device that may indicate locations of thermal energy emitted from the device. The method may also include generating a shielding map from the EM thermal maps. The shielding map may include instructions to control a shielding apparatus, including locations on the electronic device to apply an EM shielding material and a thermal material. The method may also include controlling a shielding apparatus to apply the EM shielding material and thermal material to the electronic device, according to the shielding map. The EM shielding material and thermal material may be applied to varying depths on the electronic device.