Selective Trench Capacitor Connection for Stable Wafer Power Supply

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Solution Overview

Problem

Existing semiconductor devices face challenges in maintaining high capacitance per unit area while ensuring the functionality of capacitors, as defects such as shorted or open states in capacitor structures lead to reduced yield and increased power consumption due to voltage drops on power supply wiring.

Innovation Solution

The implementation of trench capacitor structures with selective connection to good capacitors and avoidance of defective ones, combined with through vias and strategic electrode connections, enhances capacitance per unit area and ensures reliable power supply.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If capacitor structures are formed in semiconductor devices, then power supply stability is improved, but defects such as shorted or open states occur leading to reduced yield

Engineering Contradiction:
Improvepower supply stabilityVSAvoidyield
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent performs preliminary classification of capacitor structures into good and defective states before final device assembly. By evaluating capacitor characteristics early in the manufacturing process and pre-sorting them, the system prevents defective capacitors from being assembled into final devices, thereby maintaining high yield while ensuring power supply stability through selective use of only functional capacitors.

Inventive Principle:
Principle #10Preliminary action

2Reliability

If capacitor structures are formed in semiconductor devices, then power supply stability is improved, but power consumption increases due to voltage drops

Engineering Contradiction:
Improvepower supply stabilityVSAvoidpower consumption
Core Design Contradiction:
ReliabilityVSLoss of energy

Solution Approach 1:

The patent implements a feedback mechanism where capacitor structures are evaluated and classified based on their electrical characteristics. This feedback loop allows the system to identify and exclude defective capacitors that would cause voltage drops and increased power consumption, while selecting only high-performance capacitors for assembly, thereby maintaining power supply stability without the penalty of excessive power loss.

Inventive Principle:
Principle #23Feedback

3Quantity of substance

If all capacitor structures are connected, then capacitance is maximized, but defective capacitors reduce overall performance

Engineering Contradiction:
ImprovecapacitanceVSAvoidcapacitor functionality
Core Design Contradiction:
Quantity of substanceVSReliability

Solution Approach 1:

The patent extracts and removes defective capacitor structures from the assembly process through preliminary classification and evaluation. By taking out only the functional, high-quality capacitors and excluding defective ones, the system achieves maximum effective capacitance from reliable components, avoiding the performance degradation that would result from including shorted or open capacitors in the network.

Inventive Principle:
Principle #2Taking out (Extraction)

Data Source

PatentUS20260082600A1Electronic device and method of manufacturing electronic device
Publication Date: 2026.03.19 ADVANTEST CORP
  • US20260082600A1 patent drawing
  • US20260082600A1 patent drawing
  • US20260082600A1 patent drawing

AI summary

There is provided an electronic device including: a connection substrate which is provided with a plurality of capacitor structure portions; an electronic element which is provided above the connection substrate; connection wiring which connects the electronic element to the connection substrate, in which the plurality of capacitor structure portions have at least one connection capacitor portion which is connected to the connection wiring, and at least one non-connection capacitor portion which is not connected to the connection wiring. The non-connection capacitor portion may be a capacitor in a short state or an open state. The connection substrate may be a first semiconductor wafer.