Self-Acclimating Electronics Cooling With NTC-Controlled TEC
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Solution Overview
Problem
Active cooling systems for electronic packages are complex, require additional hardware and software, and can be unreliable, making them costly and space-intensive, especially in limited spaces.
Innovation Solution
A self-acclimating electronics package using a thermoelectric cooler and an electrically resistive material with a negative temperature coefficient of resistivity, which dynamically adjusts voltage supplied to the cooler based on temperature changes, eliminating the need for control hardware and software, and integrating the resistive material directly with the package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If an active cooling control system with sensors, cables, and software is used, then temperature regulation capability is improved, but device complexity and packaging space requirements increase
Solution Approach 1:
The cooling system uses the temperature-dependent resistive material's inherent property to automatically adjust cooling power based on temperature changes, eliminating the need for external sensors, control software, and regulation hardware. The system serves itself by utilizing the natural electrical properties of the resistive material to modulate the thermoelectric cooler's operation.
Solution Approach 2:
The patent replaces the mechanical/electronic control system (sensors, cables, software, regulators) with an electrical field-based solution. The temperature-dependent electrical resistance of the resistive material directly modulates the current to the thermoelectric cooler through voltage division, eliminating the need for physical control components.
2Temperature
If a dedicated active cooling system is implemented, then cooling effectiveness is improved, but packaging space is consumed
Solution Approach 1:
The temperature-dependent resistive material is integrated directly into the electrical connection path between the power source and the thermoelectric cooler, merging the temperature sensing function with the power delivery function. This eliminates the need for separate control hardware and reduces packaging space.
Solution Approach 2:
The temperature-dependent resistive material serves multiple functions: it acts as both a current carrier and a temperature sensor, while also functioning as a automatic control element. This multi-functionality reduces the number of components needed and minimizes packaging space requirements.
3Temperature
If active cooling control hardware and software are used, then temperature regulation is achieved, but system reliability decreases due to potential component failures
Solution Approach 1:
The cooling system uses the temperature-dependent resistive material's inherent property to automatically adjust cooling power based on temperature changes, eliminating the need for external sensors, control software, and regulation hardware. The system serves itself by utilizing the natural electrical properties of the resistive material to modulate the thermoelectric cooler's operation.
4Temperature
If an active cooling system with multiple components is used, then cooling control capability is improved, but manufacturing costs increase
Solution Approach 1:
The temperature-dependent resistive material is integrated directly into the electrical connection path between the power source and the thermoelectric cooler, merging the temperature sensing function with the power delivery function. This eliminates the need for separate control hardware and reduces packaging space.
Solution Approach 2:
The temperature-dependent resistive material can be implemented using inexpensive, readily available materials such as standard resistors or temperature-sensitive electrical components that are already part of the electronic system, reducing the need for specialized expensive control hardware.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides reliable, efficient, and space-efficient cooling by automatically adjusting power to the thermoelectric cooler based on temperature, reducing packaging complexity and costs while maintaining effective temperature regulation.
Implementation Method 1
a thermoelectric cooler thermally coupled to the electronic chip, wherein the thermoelectric cooler is electrically connected in series with the electrically resistive material and a power supply to cool the electronic chip
Implementation Method 2
an electrically resistive material with a negative temperature coefficient of resistivity, the electrically resistive material being thermally coupled to the electronic chip
Data Source
AI summary
A self-acclimating electronics package includes an electronic chip, an electrically resistive material with a negative temperature coefficient of resistivity, the electrically resistive material being thermally coupled to the electronic chip, and a thermoelectric cooler thermally coupled to the electronic chip. The thermoelectric cooler is electrically connected in series with the electrically resistive material and a power supply to cool the electronic chip, where if a temperature of the electronic chip increases, a resistance of the electrically resistive material decreases to cause the a voltage supplied to the thermoelectric cooler to increase, and if a temperature of the electronic chip decreases, a resistance of the electrically resistive material increases to cause the a voltage/current applied to the thermoelectric cooler to decrease. This resilient self-acclimating cooling system eliminates any control hardware, firmware, and/or software which may be costly, complicated, and may require additional packaging space and/or tuning.