Self-Actuated Socket for Parallel Thermal Testing
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Solution Overview
Problem
Traditional environmental test chambers for integrated circuits are limited by the accuracy and speed of temperature changes, requiring complex and expensive mechanisms for inserting and removing devices, which hampers testing throughput.
Innovation Solution
The development of parallel test cells with self-actuated sockets that can open and close retention mechanisms in parallel, allowing for simultaneous placement of devices under test and active thermal interposers, thereby eliminating the need for environmental chambers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If traditional environmental test chambers are used to test integrated circuits, then the devices can be subjected to environmental stress testing, but the testing accuracy is degraded due to environmental limits of the test interface circuits and devices
Solution Approach 1:
The system divides the testing environment into two separate zones: a thermally controlled zone containing only the DUT and ATI for accurate temperature control, and a room-temperature zone containing the test interface circuits and ATE. This segmentation allows each zone to be optimized independently - the thermal zone maintains precise temperature control while the interface zone operates at stable room temperature, resolving the contradiction between temperature control accuracy and interface circuit performance
Solution Approach 2:
The Active Thermal Interposer (ATI) serves as an intermediary component between the DUT and the test interface. It provides the thermal coupling necessary for environmental testing while electrically connecting the DUT to the room-temperature test equipment. This intermediary allows the DUT to experience thermal stress without exposing the sensitive test interface circuits to extreme temperatures, thereby maintaining both testing accuracy and interface reliability
2Productivity
If traditional environmental test chambers with large volumes are used, then comprehensive environmental testing can be performed, but the rate of testing is limited due to slow thermal response and complex insertion/removal mechanisms
Solution Approach 1:
The testing system is segmented into a compact thermal chamber containing only the essential thermal mass (DUT and ATI) and a separate interface area. This minimalization of the thermal zone reduces thermal mass and improves thermal response time, while the interface operations occur outside the thermal chamber, eliminating the need for complex insertion/removal mechanisms that slow down testing
Solution Approach 2:
The socket incorporates self-actuating retention mechanisms that automatically open and close based on the presence or absence of the DUT and ATI. When components are inserted or removed, the retention mechanisms self-activate to secure or release them, eliminating the need for external actuators or complex mechanical systems. This self-service approach simplifies the insertion/removal process and improves testing throughput
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables high-throughput testing by rapidly changing the thermal environment and simplifying the insertion and removal processes, improving the accuracy and efficiency of device testing.
Implementation Method 1
The socket includes a plurality of spring-loaded roller retention devices configured to retain one or more devices in the socket
Data Source
AI summary
An automated test equipment (ATE) includes a test interface board assembly. The test interface board includes a socket configured to provide electrical couplings from the test interface board to a device under test (DUT). The socket is further configured to accept an active thermal interposer (ATI) device while the DUT is disposed in the socket. The socket includes a plurality of spring-loaded roller retention devices configured to retain one or more devices in the socket. The ATE further includes a Z-axis interface plate configured to open the plurality of spring-loaded roller retention devices to enable insertion of the DUT into the socket and an ATI placement plate configured to open the plurality of spring-loaded roller retention devices to enable insertion of the ATI device into the socket.