Self-Adjusting Pressing Tool for Circuit Board Bonding
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Solution Overview
Problem
Existing electronic component bonding devices require complex configurations and high manufacturing costs due to the need for incline measuring and adjusting steps before production, which decrease productivity and increase costs.
Innovation Solution
An electronic component bonding device with multiple pressing tools supported by a 360-degree adjustable mechanism and a drive system that automatically adjusts the incline of the pressing tools to match the circuit board, eliminating the need for pre-production incline measurement and adjustment, allowing for even pressure application and accurate bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an incline measuring device and incline adjustment device are provided to measure and adjust the incline of the pressing tool before production, then the bonding reliability is improved, but the device complexity and manufacturing cost increase
Solution Approach 1:
The pressing tool is designed with self-adjusting capability through a tilting mechanism that automatically adapts to the circuit board surface incline during the bonding process, eliminating the need for external measuring and adjustment devices. The tool self-regulates its inclination angle to maintain uniform contact with the electronic component.
Solution Approach 2:
The pressing tool incorporates a dynamic tilting mechanism that allows real-time adjustment of the pressing surface angle during operation. This dynamic adaptation enables the tool to automatically compensate for circuit board warpage or incline variations, ensuring uniform pressure distribution without requiring pre-adjustment equipment.
2Manufacturing precision
If incline measuring and adjusting steps are performed before production starts, then the bonding quality is improved, but the productivity decreases due to increased process steps
Solution Approach 1:
The pressing tool automatically adjusts its incline during the bonding operation itself, integrating the adjustment function into the main process. This eliminates separate pre-production measuring and adjusting steps, maintaining bonding quality while improving productivity by reducing process cycle time.
Solution Approach 2:
The tilting mechanism is pre-configured with the capability to adjust inclination, but the actual adjustment occurs automatically during the bonding process based on real-time contact conditions, rather than requiring manual pre-adjustment. This prepares the system in advance with the capability while executing the adjustment at the optimal moment.
3Device complexity
If the pressing tool has a fixed pressing surface, then the device structure is simple, but the bonding uniformity deteriorates when the circuit board or electronic component has incline variations
Solution Approach 1:
The pressing tool replaces the fixed pressing surface with a tiltable pressing surface that can dynamically adjust its angle during operation. This allows the pressing surface to adapt to circuit board warpage or component incline variations, ensuring uniform contact and pressure distribution while maintaining relatively simple device structure.
Solution Approach 2:
The pressing tool enables change in the inclination angle parameter of the pressing surface during the bonding process. By adjusting this geometric parameter in real-time, the tool maintains optimal contact conditions with the electronic component despite variations in circuit board or component geometry, ensuring bonding uniformity.
Data Source
AI summary
An electronic component bonding device includes multiple pressing tools that apply pressure to a die on the bonding section of a circuit board, the multiple pressing tools are supported on a support block via a following mechanism so as to be able to be inclined in any direction around 360 degrees, and a driving mechanism that moves the support blocks vertically is provided. The multiple support blocks are arranged in a width direction of the circuit board, and when the circuit board is conveyed by a conveyor such that the die on the bonding section of the circuit board has reached below one of the multiple support blocks, conveyance of the circuit board is stopped, the support block is lowered by the support block driving mechanism, and the die is bonded to the bonding section of the circuit board using the pressing tool of the support block.