Self-adjusting Cooling Module Wedge Mechanism
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Solution Overview
Problem
Existing cooling modules for integrated circuits face challenges in achieving direct contact with heat sinks due to varying air gaps caused by design constraints and production tolerances, leading to inefficient heat dissipation.
Innovation Solution
A self-adjusting cooling module comprising wedges with diagonal surfaces, a solid thermal interface material, and a flexible force-exerting element, such as springs or a compressible thermal pad, which adapts to gap variations by sliding on the thermal interface material to ensure firm contact between the electronic device and the heat sink, reducing thermal resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a conventional cooling module is used with fixed geometry, then the structure is simple and easy to manufacture, but it cannot adapt to varying air gaps between electronic devices and heat sinks, leading to poor thermal contact
Solution Approach 1:
The cooling module employs a wedge-shaped element that can dynamically adjust its position along the diagonal surface, transforming from a static structure to a dynamic one that adapts to varying gap sizes. The flexible force-exerting element enables the wedge to move and self-adjust, allowing the cooling module to maintain effective thermal contact across different gap conditions without requiring multiple fixed-geometry components.
Solution Approach 2:
The invention changes the geometric parameters of the cooling module by introducing a wedge shape with diagonal surfaces. This parameter change allows the module to vary its effective height and contact pressure by sliding along the diagonal surface, enabling adaptation to different gap sizes while maintaining a relatively simple overall structure.
2Manufacturing precision
If the cooling module is designed to fit small gaps, then it works well for tight tolerances, but it cannot accommodate larger gaps caused by production variations, and vice versa
Solution Approach 1:
The wedge-shaped cooling element with flexible force-exerting capability transforms the static cooling module into a dynamic system that can adjust to various gap sizes. This allows the same module design to accommodate both small gaps (tight tolerances) and larger gaps (production variations) by sliding the wedge along its diagonal surface to the appropriate position.
Solution Approach 2:
The cooling module is designed with universal adaptability through the wedge mechanism, allowing a single design to serve multiple gap size requirements. The flexible force-exerting element enables the module to function effectively across a wide range of gap conditions, eliminating the need for multiple specialized components for different tolerance ranges.
3Reliability
If rigid components are used in the cooling module, then the structure is stable and easy to manufacture, but it cannot maintain firm contact with the heat sink when gap variations occur, reducing heat dissipation efficiency
Solution Approach 1:
The cooling module incorporates a flexible force-exerting element that provides the necessary compliance to maintain reliable thermal contact. This flexible component allows the rigid wedge-shaped cooling element to adjust its position and maintain firm contact with the heat sink, ensuring reliable heat dissipation while keeping the overall structure manufacturable with standard components.
4Reliability
If thermal interface material is used to fill gaps, then thermal contact is improved, but excessive material increases thermal resistance and reduces cooling efficiency
Solution Approach 1:
The wedge-shaped cooling element acts as an intermediary mechanism that mechanically bridges the gap between the electronic device and heat sink. By sliding the wedge along its diagonal surface, the system achieves direct mechanical contact that minimizes the need for excessive thermal interface material, thereby reducing thermal resistance while maintaining reliable thermal contact.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The module effectively conducts heat across varying gap sizes and shapes, enhancing cooling efficiency by maintaining firm physical and thermal contact, thus preventing device malfunction and damage from excessive heat.
Implementation Method 1
The solid TIM is disposed between the first and second diagonal surfaces and is configured to transfer heat between the first and second wedges
Implementation Method 2
The flexible force-exerting element is configured to move the first wedge or the second wedge, so as to slide the first diagonal surface or the second diagonal surface on the TIM and push the second flat surface against the heat sink
Implementation Method 3
slide the first diagonal surface or the second diagonal surface on the TIM
Data Source
AI summary
A cooling apparatus includes first and second wedges, a solid thermal interface material (TIM) and a flexible force-exerting element. The first wedge has a first flat surface and a first diagonal surface. The first flat surface is configured to dissipate heat from an electronic device. The second wedge has a second flat surface and a second diagonal surface. The second diagonal surface faces the first diagonal surface, and the second flat surface is coupled to a heat sink and configured to dissipate heat thereto. The TIM is disposed between the first and second diagonal surfaces, and is configured to transfer heat between the first and second wedges. The force-exerting element is configured to move the first wedge or the second wedge, so as to slide the first diagonal surface or the second diagonal surface on the TIM and push the second flat surface against the heat sink.