Self-Aligned Electroplated Metal Layer for Lens Alignment
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Solution Overview
Problem
Conventional methods for fabricating digital camera lenses face challenges in achieving high accuracy alignment between light-shielding patterns, leading to suboptimal optical characteristics due to the use of photolithography and etching processes, which are prone to errors and defects.
Innovation Solution
A method involving the formation of self-aligned electroplated metal layers on a conductive substrate, where the conductive layer acts as an electrode to duplicate patterns without etching, ensuring high pattern consistency and accuracy by using transparent conductive layers for alignment and electroplating to form light-shielding layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If photolithography and etching processes are used to form light-shielding patterns, then the manufacturing process is conventional and established, but the alignment accuracy between patterns deteriorates
Solution Approach 1:
The conductive layer serves as both the pattern definition layer and the electrode for electroplating. The pattern formed in the conductive layer automatically becomes the template for metal deposition, eliminating the need for separate alignment processes. The system uses itself (the conductive layer pattern) to define the subsequent metal layer pattern, achieving self-aligned fabrication.
Solution Approach 2:
The patent replaces the mechanical/chemical photolithography-etching alignment system with an electrochemical electroplating system. Instead of using photomasks, aligners, and etching processes that require manual or automated alignment mechanisms, the invention uses electroplating where the patterned conductive layer itself serves as the electrode, and metal ions are deposited conformally to create the light-shielding pattern with inherent alignment.
2Reliability
If manual alignment processes are used, then the process is simple to implement, but defects increase and pattern consistency deteriorates
Solution Approach 1:
The patterned conductive layer automatically serves as the electrode for electroplating, eliminating manual alignment operations. The system defines its own processing parameters through the conductive layer pattern geometry, achieving consistent pattern transfer without human intervention or complex alignment equipment.
3Reliability
If black photoresist is used for light-shielding, then the material is conventional and easy to apply, but defects increase and adhesion deteriorates
Solution Approach 1:
The invention changes the fundamental parameter of the light-shielding layer material from organic photoresist to inorganic metal layers formed by electroplating. This material parameter change eliminates the inherent defects of photoresist (particle contamination, poor adhesion, development issues) while providing superior adhesion to the substrate and pattern consistency.
Solution Approach 2:
The patent creates a composite structure where the light-shielding function is achieved through electroplated metal layers deposited on the patterned conductive layer. This composite approach combines the advantages of electroplating (adhesion, precision) with the simplicity of conductive layer patterning, eliminating the need for black photoresist while improving overall reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves alignment accuracy and optical characteristics of lens modules by eliminating the need for manual operations and reducing pattern defects associated with black photoresist, enhancing the profile and Critical Dimension (CD) accuracy of light-shielding patterns.
Implementation Method 1
electroplating the conductive layer to form thereon an electroplated metal layer such that the pattern is transferred in the electroplated metal layer
Implementation Method 2
the conductive layer may be electroplated with chromium, copper, tungsten, aluminum, silver, chromium sesquioxide, thallium nitride, or silver oxide to form the electroplated metal layer
Data Source
AI summary
A method of fabricating a self-aligned metal layer structure is disclosed. The method includes: providing a substrate including a conductive layer; forming a pattern in the conductive layer; and electroplating the conductive layer to form thereon an electroplated metal layer such that the pattern is directly transferred in the electroplated metal layer in a self-aligned manner. Methods of fabricating optics are also disclosed. The methods are capable of high accuracy in alignment, and the optics can be used in the production of a lens module.