Self-aligned Graphene FET via Seed Layer

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Solution Overview

Problem

Current methods cannot fabricate self-aligned graphene transistors due to differences in material processing requirements between silicon and carbon, particularly in minimizing parasitic capacitance and resistance between source/drain and gate electrodes.

Innovation Solution

A method involving a seed layer, gate oxide, and gate metal is used to form a self-aligned graphene field effect transistor with an insulating layer and a graphene sheet, where the gate stack is encapsulated in a spacer material to align source/drain and gate electrodes without lithographic alignment, utilizing ALD oxide and metal electrodes to create a minimal un-gated region.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If oxide side-wall is formed surrounding the gate stack before source/drain contact formation (Si MOSFET method), then self-alignment is achieved, but this technique cannot be directly applied to graphene due to differences in material processing requirements

Engineering Contradiction:
ImproveSelf-alignment fabricationVSAvoidMaterial processing compatibility
Core Design Contradiction:
Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

A seed layer is introduced as an intermediary between the graphene sheet and the gate oxide. This seed layer enables the formation of gate oxide on graphene surfaces, which otherwise cannot be directly formed due to material incompatibility. The seed layer mediates the processing difference between silicon and carbon-based materials, allowing the self-aligned fabrication approach to work with graphene.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The invention changes the surface properties of graphene by depositing a seed layer, which alters the material parameters to enable subsequent oxide formation. This parameter change (adding the seed layer) transforms graphene from a material that cannot support direct oxide growth to one that can, thereby enabling self-aligned fabrication.

Inventive Principle:
Principle #35Parameter changes

2Manufacturing precision

If lithographic alignment is used to align source/drain and gate electrodes, then alignment precision is achieved, but device complexity and manufacturing steps increase

Engineering Contradiction:
ImproveElectrode alignment precisionVSAvoidFabrication process complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The fabrication process is designed to be self-aligning, where the gate stack structure and spacer material automatically define the precise positions of source/drain electrodes without requiring external lithographic alignment steps. The process self-corrects and self-positions, eliminating complex alignment procedures while maintaining high precision.

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The gate stack is formed and encapsulated with spacer material before source/drain contact formation. This preliminary action of creating the encapsulated gate stack structure establishes the alignment framework in advance, so that subsequent source/drain deposition automatically occurs in the correct positions without requiring additional alignment steps.

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS8106383B2Self-aligned graphene transistor
Publication Date: 2012.01.31 GLOBALFOUNDRIES US INC
  • US8106383B2 patent drawing
  • US8106383B2 patent drawing
  • US8106383B2 patent drawing

AI summary

A graphene field effect transistor includes a gate stack, the gate stack including a seed layer, a gate oxide formed over the seed layer, and a gate metal formed over the gate oxide; an insulating layer; and a graphene sheet displaced between the seed layer and the insulating layer.