Self-Aligned Optical Coupling Structure for Photonic Channels
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Solution Overview
Problem
Current optical coupling methods for photonic components require active alignment processes that are time-consuming, costly, and reduce manufacturing efficiency due to the need for external light sources and complex setups.
Innovation Solution
A self-aligned optical coupling system where the optical element is passively aligned with the photonic component using solder bumps with surface tension during the reflow process, allowing for precise and efficient optical transmission without active alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If active alignment process is used with external light source, then optical coupling precision can be achieved, but manufacturing time and cost increase significantly
Solution Approach 1:
The optical element is pre-aligned with the optical waveguide during the packaging process before final assembly. The self-alignment structure is designed such that the optical element's position is predetermined by the packaging substrate, eliminating the need for post-assembly active alignment and light source testing.
Solution Approach 2:
The optical element utilizes the packaging substrate's structural features to automatically position itself relative to the optical waveguide. The self-alignment mechanism relies on the inherent geometric relationships and tolerance accumulations of the packaging process, allowing the optical element to find its correct position without external intervention or active alignment equipment.
2Manufacturing precision
If active alignment process is used with external light source, then optical coupling precision can be achieved, but manufacturing complexity increases
Solution Approach 1:
The external light source and active alignment equipment are completely removed from the manufacturing process. The patent extracts these complex components and replaces them with a passive self-alignment structure that relies solely on the packaging substrate's geometric features and standard packaging processes.
Solution Approach 2:
The packaging substrate serves multiple functions: it provides mechanical support, electrical connections, and optical alignment references. The self-alignment structure integrates these functions into a single unified approach, eliminating the need for separate alignment equipment and procedures.
3Productivity
If self-aligned optical element is used, then manufacturing efficiency increases, but alignment precision must be maintained
Solution Approach 1:
The optical element's position is predetermined during the packaging process through precise mechanical structuring. The self-alignment features are built into the packaging substrate before the optical element is installed, ensuring that alignment precision is achieved through pre-planned geometric relationships rather than post-assembly adjustment.
4Manufacturing precision
If traditional active alignment is used, then optical coupling can be achieved, but device size increases
Solution Approach 1:
The optical element and its alignment structure are merged into a single integrated component mounted on the packaging substrate. The self-alignment structure eliminates the need for separate external light sources, alignment equipment, and adjustment mechanisms, thereby reducing the overall device volume while maintaining optical coupling functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing time and cost, increases production throughput, and enhances alignment accuracy and precision, while also reducing the overall size of the electronic device.
Implementation Method 1
The optical element is passively aligned with the photonic component using solder bumps with surface tension during the reflow process
Data Source
AI summary
An electronic device is provided. The electronic device includes a photonic component, a first optical element, and a second optical element. The photonic component includes an optical channel. The first optical element is configured to optically couple with the optical channel. The second optical element is self-aligned with the optical channel and defined at a specific position to be configured to direct an optical signal between the optical channel and the first optical element.