Semiconductor Package Structure With Self-Aligned Thermal Solder Bumps
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Solution Overview
Problem
The challenge is to create a semiconductor package structure with high accuracy and yield, effective heat dissipation, and cost-effective fabrication, while ensuring precise alignment and efficient heat transfer, particularly for high-density input/output terminals in compact devices like smartphones and wearables.
Innovation Solution
A semiconductor package structure is developed with a base substrate, a die, and solder bumps and balls that self-align during reflow, allowing for efficient heat dissipation through heat dissipation plugs and precise signal transmission, using a simplified process that reduces fabrication costs and maintains high heat-dissipating properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional alignment methods are used to position die on substrate, then positioning accuracy can be maintained, but fabrication complexity and cost increase
Solution Approach 1:
The solder bumps perform self-alignment function during the reflow process. When the solder is heated and melts, surface tension causes the solder to automatically align with the corresponding pads on the substrate, eliminating the need for complex external alignment mechanisms or procedures. This self-service approach achieves high positioning accuracy while simplifying the fabrication process.
Solution Approach 2:
The invention utilizes the phase transition of solder from solid to liquid during reflow processing. This phase transition enables the solder to flow and self-align with the pads through surface tension effects, providing automatic positioning capability without requiring complex alignment equipment or procedures.
2Temperature
If heat dissipation structures are added to manage thermal issues, then heat dissipation performance improves, but device complexity increases
Solution Approach 1:
The solder bumps serve multiple functions simultaneously: electrical connection, mechanical bonding, and heat dissipation. By making the solder bumps multi-functional, the invention eliminates the need for separate dedicated heat dissipation structures, thereby improving thermal management while maintaining structural simplicity.
Solution Approach 2:
The invention merges the heat dissipation function with the existing solder bump structure. Instead of adding separate heat dissipation components, the thermal management capability is integrated into the solder bumps themselves, combining multiple functions into a single element to reduce overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves fabrication yield and reduces costs by enabling self-alignment of the die on the substrate, enhancing heat dissipation and maintaining high heat-dissipating properties, thus addressing the need for accurate positioning and efficient heat management in compact semiconductor packages.
Implementation Method 1
the die and a metal pad on the substrate are automatically self-aligned to each other, when temperature of the melted solder is returned to a room temperature
Implementation Method 2
the die and a metal pad on the substrate are automatically self-aligned to each other, when temperature of the melted solder is returned to a room temperature
Implementation Method 3
a solder bump disposed on a surface of the die, and configured to dissipate heat generated in the die to an outside
Data Source
AI summary
A method of fabricating a semiconductor package structure is provided. The structure is configured to include a base substrate, a die placed on the base substrate, the die including a semiconductor device, a solder bump placed on one surface of the die to exhaust heat generated in the die to an outside; and a solder ball placed on other surface of the die facing the one surface to transmit a signal, which is produced by the semiconductor device of the die, to an external device.