Self-aligned trench contacts via replacement gate mandrels

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Solution Overview

Problem

Current replacement gate processes for semiconductor transistors face alignment issues and complexity in forming trench contacts and local interconnects, leading to high manufacturing costs and susceptibility to misalignment errors.

Innovation Solution

The process involves forming insulating mandrels and mandrel spacers with a sloping profile to create self-aligned trench contacts that extend above the gates, allowing for a simpler local interconnect scheme and reducing the number of resistive interfaces, using CAD-designed resist patterns and selective etching techniques.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional replacement gate processes are used to form trench contacts and local interconnects, then the transistor structure can be formed, but alignment issues and process complexity increase manufacturing costs and reduce yield

Engineering Contradiction:
Improvealignment accuracyVSAvoidprocess complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies preliminary action by forming the trench contact pattern before the gate pattern through a sequence of preparatory steps: forming mandrels, depositing first and second spacer layers, and performing selective etching to create the trench contact opening. This preliminary structuring establishes self-alignment features that guide subsequent gate formation, ensuring accurate alignment without requiring complex alignment procedures at later stages.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent implements self-service through self-aligned processes where the trench contact structure automatically defines the gate position. The mandrel and spacer layers create physical references that guide material deposition and etching steps, allowing the structure to self-align without external alignment tools or complex photolithography steps. The trench contact opening position is determined by the mandrel-spacer geometry rather than separate alignment operations.

Inventive Principle:
Principle #25Self-service

2Manufacturing precision

If complex process flows are used to create self-aligned trench contacts, then alignment accuracy improves, but manufacturing cost and process complexity increase

Engineering Contradiction:
Improvealignment precisionVSAvoidmanufacturing ease
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent applies segmentation by dividing the alignment problem into distinct functional layers: mandrels provide the primary alignment reference, the first spacer layer defines lateral offsets, and the second spacer layer refines the trench contact position. Each layer performs a specific alignment function, breaking down the complex alignment task into manageable segments that can be formed using standard deposition and etching processes rather than requiring a single complex self-aligned step.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent uses parameter changes by varying the thicknesses and materials of the mandrel and spacer layers to control the final trench contact dimensions and position. By adjusting spacer layer thickness parameters, the process achieves precise alignment control while using conventional deposition techniques. The etch selectivity parameters between different layers are optimized to enable selective removal of materials without affecting adjacent structures, simplifying the overall manufacturing process.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS8564030B2Self-aligned trench contact and local interconnect with replacement gate process
Publication Date: 2013.10.22 ADVANCED MICRO DEVICES INC
  • US8564030B2 patent drawing
  • US8564030B2 patent drawing
  • US8564030B2 patent drawing

AI summary

A semiconductor device fabrication process includes forming insulating mandrels over one or more replacement metal gates on a semiconductor substrate. The mandrels include a first insulating material. Each mandrel has approximately the same width as its underlying gate with each mandrel being at least as wide as its underlying gate. Mandrel spacers are formed around each insulating mandrel. The mandrel spacers include the first insulating material. Each mandrel spacer has a profile that slopes from being wider at the bottom to narrower at the top. A second insulating layer of the second insulating material is formed over the transistor. Trenches to the sources and drains of the gates are formed by removing the second insulating material from portions of the transistor between the mandrels. Trench contacts to the sources and drains of the gates are formed by depositing conductive material in the first trenches.