Self-Aligning Batch Die Bonding With Capillary Water Placement
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Solution Overview
Problem
Current die-to-wafer bonding processes are inefficient in bonding multiple semiconductor dies of different types, sizes, and layouts simultaneously, requiring precise positioning and machinery changes, which increases production time and can result in misalignments and non-usable components.
Innovation Solution
A self-aligning die-to-wafer bonding process using capillary forces with deionized water to align semiconductor dies on hydrophilic regions of the wafer, allowing for the placement of diverse die configurations without precise positioning, facilitated by a pick-and-place assembly and fluid dispensing system that dispenses controlled water droplets to guide die placement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If precise positioning and machinery changes are used for bonding multiple semiconductor dies of different types and sizes, then alignment accuracy is improved, but production time increases
Solution Approach 1:
The patent employs self-aligning features on the semiconductor dies that automatically guide proper positioning during the bonding process. The dies contain alignment structures such as notches, protrusions, or asymmetric patterns that naturally orient them correctly on the target wafer without requiring external positioning machinery or complex alignment systems, thereby eliminating machinery changes and reducing production time while maintaining high alignment accuracy
Solution Approach 2:
The patent replaces complex mechanical positioning systems and alignment machinery with self-aligning die structures. Instead of using precision stages, vision systems, or mechanical adjustment mechanisms to achieve accurate placement, the invention uses geometric self-alignment features that passively guide the dies into correct positions through simple placement, substituting complex mechanical alignment systems with passive geometric constraints
2Manufacturing precision
If precise positioning is used for die placement, then alignment accuracy is improved, but device complexity increases
Solution Approach 1:
The semiconductor dies are designed with self-aligning features such as asymmetric patterns, notches, or protrusions that automatically guide their orientation and position during placement. This self-service mechanism eliminates the need for complex external positioning machinery, vision systems, or alignment devices, thereby reducing device complexity while maintaining high alignment accuracy through the die's own geometric features
Solution Approach 2:
Instead of using complex machinery to force precise alignment of the dies, the patent inverts the approach by designing the dies themselves to carry alignment information and features. The alignment capability is built into the die structure rather than being provided by external equipment, simplifying the overall system by removing complex positioning machinery
3Adaptability or versatility
If machinery changes are made for different die configurations, then adaptability is improved, but production time increases
Solution Approach 1:
The patent employs a universal bonding process and equipment configuration that can handle multiple die types, sizes, and layouts simultaneously. The self-aligning features on each die enable the same bonding machinery to process diverse die configurations without requiring changes to the equipment or process parameters, providing multi-functionality and adaptability while maintaining high production speed
Solution Approach 2:
Each die contains self-aligning features that automatically adapt to its specific type, size, and layout requirements. This self-service capability allows the bonding process to accommodate different die configurations without requiring machinery changes, as each die self-configures during placement through its inherent alignment structures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces production time by eliminating the need for precise die placement and machinery changes, enabling faster and more accurate bonding of multiple die types and sizes on a single wafer while maintaining high alignment accuracy through capillary self-alignment.
Implementation Method 1
A self-aligning die-to-wafer bonding process using capillary forces with deionized water to align semiconductor dies on hydrophilic regions of the wafer
Data Source
AI summary
Systems, apparatus, articles of manufacture, and methods are disclosed to self-align batch pick and place die bonding. Disclosed is an apparatus comprising a fluid dispensing assembly to dispense first amounts of water onto first hydrophilic regions of a first semiconductor wafer at a first point in time, the first hydrophilic regions having a first arrangement, and dispense second amounts of water onto second hydrophilic regions of a second semiconductor wafer at a second point in time, the second hydrophilic regions having a second arrangement, and a pick-and-place assembly to simultaneously position, at the first point in time, a first batch of dies corresponding to the first arrangement onto the first amounts of water dispensed on the first semiconductor wafer, and simultaneously position, at the second point in time, a second batch of dies corresponding to the second arrangement onto the second amounts of water dispensed on the second semiconductor wafer.