On-Package Self-Aligning Expanded-Beam Connector for Shock Isolation

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Solution Overview

Problem

Integrated circuit designs face challenges in improving performance and reliability due to optical signal attenuation and propagation losses, especially in co-packaged optics systems, where conventional fiber connections are prone to failure from shock, vibration, and dust contamination.

Innovation Solution

The development of self-aligning expanded-beam connectors using glass blocks with V-grooves and micro lens arrays to support fiber arrays, enabling passive alignment and minimizing signal losses, with components designed for harsh environments and compatible with solder reflow technology.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional pigtail fiber arrays are used for optical interfaces, then fiber connection is achieved, but the package is vulnerable to shock and vibration causing overstress and failure

Engineering Contradiction:
Improvepackage reliabilityVSAvoidshock and vibration stress
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The optical connector is divided into two separable sections: a first section coupled to the photonic integrated circuit and a second section coupled to the fiber optic jumper. This segmentation allows the fiber array to be isolated from shock and vibration stresses during operation, while maintaining reliable optical connection when mated.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The detachable connector assembly acts as an intermediary between the photonic integrated circuit and the fiber optic jumper. This intermediary protects the PIC from direct mechanical stress while enabling optical signal transmission, and allows the fiber array to be replaced without damaging the PIC.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Ease of repair

If detachable connectors are used to enable fiber replacement, then maintenance capability is improved, but dust contamination and optical losses increase

Engineering Contradiction:
Improvefiber replacement capabilityVSAvoiddust contamination
Core Design Contradiction:
Ease of repairVSObject-affected harmful factors

Solution Approach 1:

The fiber array is extracted from the photonic integrated circuit package and placed in a separate, replaceable connector section. This allows the fiber array to be removed and replaced independently when contaminated or damaged, while the PIC remains protected and stationary.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The connector includes self-aligning features with alignment members that automatically guide proper positioning during assembly. This self-alignment capability ensures consistent optical coupling without requiring complex manual adjustment, reducing the risk of dust contamination during the replacement process.

Inventive Principle:
Principle #25Self-service

3Loss of energy

If direct fiber attachment is used to minimize connection points, then propagation losses are reduced, but the system lacks protection against environmental stresses

Engineering Contradiction:
Improveoptical signal lossVSAvoidresistance to environmental stresses
Core Design Contradiction:
Loss of energyVSReliability

Solution Approach 1:

The fiber array is pre-aligned and secured in the first connector section with proper positioning features before mating with the second section. This preliminary alignment ensures optimal optical coupling when connected, minimizing propagation losses while maintaining stress protection.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The detachable connector design provides beforehand protection by isolating the fiber array from environmental stresses during operation. The separable connection allows the fiber array to be cushioned from shock and vibration while maintaining optical connection, preventing damage before it occurs.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

4Volume of moving object

If small form factor connectors are used to fit within optical packages, then package integration is improved, but alignment precision becomes more difficult to achieve

Engineering Contradiction:
Improveconnector sizeVSAvoidalignment precision
Core Design Contradiction:
Volume of moving objectVSManufacturing precision

Solution Approach 1:

The connector includes asymmetric alignment members with specific geometric features that provide unique positioning references. These asymmetric features ensure precise alignment in the compact connector design by eliminating rotational and translational ambiguities during mating.

Inventive Principle:
Principle #4Asymmetry

Solution Approach 2:

The alignment system uses features extending in multiple dimensions within the compact connector volume. Alignment members protrude in specific directions and engage with corresponding receptacles, providing precise positioning constraints in three-dimensional space within the small form factor.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides reliable, low-maintenance optical connections with reduced signal losses and improved robustness against environmental stresses, ensuring efficient communication and computation in photonic integrated circuits.

Implementation Method 1

a first micro lens array (MLA) to expand and collimate the optical beam from the fiber array

Methodology Applied
Scientific EffectOptical beam expansion and collimation: Lens

Implementation Method 2

glass blocks with V-grooves and micro lens arrays to support fiber arrays, enabling passive alignment

Methodology Applied
Scientific EffectGeometric alignment constraint: Geometry

Data Source

PatentUS20250306294A1On-Package Self-Aligning Expanded-Beam Connector
Publication Date: 2025.10.02 INTEL CORP
  • US20250306294A1 patent drawing
  • US20250306294A1 patent drawing
  • US20250306294A1 patent drawing

AI summary

In the various aspects, an optical package includes an optical connector that is at least partially configured with a first thickness that is less than a second thickness of the optical package. The optical package includes an assembly platform, a photonic integrated circuit disposed on the assembly platform, and the optical connector includes a housing with a first section and a second section, and an attachment assembly. In an aspect, the first section of the housing is disposed proximally to an edge of the assembly platform and is coupled to the photonic integrated circuit in the optical package, and the second section of the housing is coupled to a fiber optic jumper, and the attachment assembly joins the second section to the first section and enables the second section to be detached from the first section.