Self-Aligning Interconnect Bridges for Precise Chip Assembly
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Solution Overview
Problem
Manufacturing semiconductor chips with high performance computing applications faces challenges such as unwanted material interactions, precision and scaling requirements, power delivery, limited failure tolerance, and increased material and manufacturing costs, particularly in integrating multiple semiconductor chips with interconnect bridges.
Innovation Solution
The use of self-alignment structures for interconnect bridges, including alignment features and receiving cavities, to facilitate precise alignment and connection between semiconductor chips and package substrates, utilizing conductive vias and traces, and employing methods like laser cavity drilling and electrodeposition to form metallic protrusions and interconnect bridges.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional alignment methods are used for interconnect bridges, then manufacturing process is simpler, but alignment precision and assembly yields deteriorate
Solution Approach 1:
The interconnect bridge structure includes self-alignment features where protrusions on the bridge automatically align with receiving cavities on the substrate during assembly. This self-aligning mechanism eliminates the need for external alignment tools or complex alignment processes, thereby improving alignment precision without proportionally increasing structural complexity.
Solution Approach 2:
The alignment protrusions and receiving cavities are pre-formed on the interconnect bridge and substrate respectively, before the final assembly step. This preliminary preparation of alignment features ensures that when the bridge is placed on the substrate, the alignment is already established, improving manufacturing precision while keeping the overall process manageable.
2Productivity
If alignment protrusions and receiving cavities are added to interconnect bridges, then assembly yields improve, but manufacturing complexity increases
Solution Approach 1:
The alignment protrusions are integrated into the interconnect bridge structure itself, combining the alignment function with the interconnect function in a single component. This merging approach improves assembly yields by ensuring proper alignment while avoiding the need for separate alignment fixtures or tools, thereby not significantly increasing manufacturing complexity.
3Manufacturing precision
If laser cavity drilling and electrodeposition are used to form alignment features, then alignment precision improves, but manufacturing costs increase
Solution Approach 1:
The patent employs laser cavity drilling to create precise cavities and electrodeposition to form conductive protrusions with controlled dimensions and properties. By optimizing the parameters of these processes (laser power, cavity dimensions, deposition thickness), high alignment precision is achieved while controlling material consumption and manufacturing costs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances assembly yields and reduces material and manufacturing costs by improving alignment and interconnect precision, thereby supporting high-performance computing applications with increased integration density.
Implementation Method 1
creating a cavity in a partially manufactured substrate to expose interconnect bridge-side landing pads and alignment feature regions
Implementation Method 2
electrodepositing a metal into the cavities forming alignment features
Data Source
AI summary
Assemblies that include package substrates and semiconductor chips are provided. The package substrates include interconnect bridges having through-bridge vias. The assemblies also include alignment features and receiving cavities.