Optoelectronic Semiconductor Assembly With Self-Aligning Optical Element
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Solution Overview
Problem
The complex alignment of optical elements relative to semiconductor components in optoelectronic devices leads to time-consuming and potentially skewed coupling of electromagnetic radiation, resulting in defective components.
Innovation Solution
The use of a molded body with an alignment surface on a lead frame allows for self-alignment of the optical element, eliminating the need for manual alignment and ensuring efficient coupling of electromagnetic radiation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If manual alignment is used for mounting optical elements, then coupling precision can be adjusted, but the production process becomes time-consuming and complex
Solution Approach 1:
The patent implements preliminary action by pre-forming alignment surfaces on the lead frame and molded body before component mounting. These alignment surfaces are created during the molding process itself, establishing precise geometric references in advance that guide the optical element positioning without requiring subsequent manual alignment operations.
Solution Approach 2:
The patent applies self-service through self-aligning features where the optical element automatically positions itself relative to the semiconductor chip and lead frame. The alignment surfaces and geometric constraints built into the molded body and lead frame structure enable the components to self-align during assembly, eliminating the need for external alignment tools or manual adjustment.
2Manufacturing precision
If complex alignment procedures are implemented, then coupling accuracy improves, but the risk of tilted or skewed coupling increases
Solution Approach 1:
The patent replaces complex mechanical alignment procedures with geometric constraint-based self-alignment. Instead of using mechanical adjustment mechanisms or manual positioning tools, the design employs precisely formed alignment surfaces and geometric features that mechanically constrain the optical element to its correct position and orientation through the molding process itself.
Solution Approach 2:
By pre-forming the alignment surfaces and geometric constraints during the molding process, the patent establishes the correct coupling geometry before assembly occurs. This preliminary preparation ensures that when components are brought together, they naturally assume the correct aligned position, preventing tilted or skewed coupling.
3Productivity
If automated mounting is implemented, then production speed increases, but alignment precision may be compromised
Solution Approach 1:
The patent enables automated mounting to achieve high precision by implementing self-aligning features. The optical element and mounting structure are designed with complementary geometric features that automatically find their correct relative positions during assembly, allowing automated equipment to place components quickly without sacrificing alignment accuracy.
Solution Approach 2:
The alignment surfaces and geometric constraints are pre-formed during the molding process, creating built-in alignment guides that work seamlessly with automated mounting equipment. This preliminary preparation of alignment features enables fast automated placement while maintaining precise alignment through the geometric constraints embedded in the structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the mounting process, reduces defects, and enhances the efficiency of electromagnetic radiation coupling, while providing mechanical protection and stability to the semiconductor components.
Implementation Method 1
the optical element is arranged to deflect or shape a beam of an electromagnetic radiation
Implementation Method 2
the optical element is arranged to deflect or shape a beam of an electromagnetic radiation
Data Source
AI summary
In an embodiment an optoelectronic semiconductor component includes a lead frame having a first mounting surface, a semiconductor chip arranged on the first mounting surface and having an emission surface, an optical element and a molded body, wherein the optical element has an input-coupling surface oriented transverse to the first mounting surface, wherein the semiconductor chip is configured to emit electromagnetic radiation through the emission surface, a radiation axis of which is parallel to the first mounting surface, wherein the optical element is configured to deflect the electromagnetic radiation of the semiconductor chip coupled in via the input-coupling surface, wherein the molded body is attached to the lead frame and has an alignment surface transverse to the first mounting surface, and wherein the optical element and the alignment surface are in direct contact with each other.