Self-Aligning Optical Coupling for Relaxed Assembly Tolerances
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Solution Overview
Problem
Challenges exist in coupling optical signals and integrating optical components with electrical components, particularly in achieving accurate alignment and assembly, which is tedious and requires high precision.
Innovation Solution
The implementation of a self-aligning optical surface coupling scheme using a novel mirror arrangement, allowing optical components to be coupled in different planes, transferring accuracy and tolerance requirements from the assembly domain to the production domain, and utilizing wafer-level processes for precise placement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional side coupling methods are used to couple optical components, then optical signal transmission is achieved, but assembly complexity and time increase due to tedious alignment requirements
Solution Approach 1:
The patent applies preliminary action by pre-aligning optical components during the wafer-level packaging process before final assembly. The optical components are positioned and aligned on the wafer substrate in advance, so that when the package is assembled, the alignment is already established, eliminating the need for time-consuming field alignment procedures.
Solution Approach 2:
The patent replaces manual mechanical alignment with automated wafer-level positioning systems. The mechanical alignment process is substituted by precision manufacturing processes that achieve alignment during wafer fabrication, replacing tedious hand-adjustment procedures with automated positioning mechanisms.
2Manufacturing precision
If highly accurate alignment is performed during assembly to achieve proper optical coupling, then coupling precision is improved, but assembly complexity increases
Solution Approach 1:
Alignment precision is achieved through preliminary positioning during wafer fabrication rather than during final assembly. The optical components are pre-aligned on the wafer substrate using precision manufacturing techniques, transferring the alignment function from the assembly domain to the production domain where it can be achieved more easily and with less complexity.
Solution Approach 2:
The patent moves the alignment function to a different domain (wafer-level production) rather than attempting to achieve it during component assembly. By establishing alignment during wafer fabrication in a controlled manufacturing environment, the complexity of field assembly is reduced while maintaining high precision through automated positioning systems.
3Reliability
If traditional optical coupling methods are used, then optical components can be coupled, but assembly tolerances must be extremely tight increasing manufacturing difficulty
Solution Approach 1:
The patent achieves reliable optical coupling with relaxed assembly tolerances by pre-establishing precise positioning during wafer-level packaging. The critical alignment is performed during wafer fabrication where precision manufacturing processes can achieve tight tolerances, allowing the final assembly to use less stringent tolerance specifications while maintaining coupling reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the need for precise assembly tolerances, enabling efficient optical coupling and integration with relaxed assembly requirements, facilitating high-volume packaging and simplified assembly of optical components.
Implementation Method 1
a novel mirror arrangement as described more fully herein
Data Source
AI summary
Apparatuses, systems and methods for optical coupling, optical integration, electro-optical coupling, and electro-optical packaging are described herein. Optical couplers may comprise various optical elements (e.g., mirrors as described herein) to relax optical assembly requirements and improve producibility. Optical couplers may improve fiber-to-chip, fiber-to-fiber and chip-to-chip optical connection. Optical couplers and optical components may be used to improve integration of, connection of, and/or packaging of optical systems and/or components with electrical systems and/or components.