Self-Aligning Die Placement Tip for Planarity and Low Scrubbing
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Solution Overview
Problem
Current die bonding systems struggle to achieve satisfactory bonding performance and yield when attaching newer generations of dies to substrates, particularly due to increased connection density and varying die sizes, leading to planarity errors and potential damage during placement, with existing solutions either failing to prevent die scrubbing or requiring time-consuming recalibration and head swapping.
Innovation Solution
A self-aligning tip system with a lockable swivel collar and adjustable tip holder ensures planarity by allowing the tip to swivel in roll, pitch, and yaw while maintaining theta registration, minimizing force and reducing scrubbing, and incorporates a turret system for efficient placement of multiple die types without manual head swapping.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a rigid tip holder is used to maintain precise positioning, then placement accuracy is improved, but the tip cannot self-align to non-planar die surfaces, worsening bonding uniformity
Solution Approach 1:
The tip holder incorporates a swivel collar that allows the tip to dynamically adjust its angular orientation (roll, pitch, yaw) to self-align with non-planar die surfaces while maintaining precise positional control. This dynamic adjustment capability resolves the contradiction by enabling both accurate positioning and uniform bonding contact.
Solution Approach 2:
The system changes the angular parameters (orientation angles) of the tip relative to the substrate by allowing rotation through the swivel collar mechanism. This parameter adjustment enables the tip to adapt to varying die planarity while maintaining placement precision.
2Reliability
If high bonding force is applied to ensure contact between die and substrate, then bonding reliability is improved, but die scrubbing and potential damage increase
Solution Approach 1:
The tip automatically self-aligns to the die surface geometry through the swivel collar mechanism, eliminating the need for high external forces to achieve proper contact. The system serves itself by adapting to the die surface, thereby reducing harmful scrubbing forces while ensuring reliable bonding.
Solution Approach 2:
The dynamic angular adjustment capability allows the tip to conform to the die surface without requiring excessive force, thereby achieving reliable bonding while minimizing die scrubbing and damage.
3Adaptability or versatility
If manual head swapping is performed to accommodate different die types, then system adaptability is improved, but cycle time increases and contamination risk worsens
Solution Approach 1:
The tip holder system is designed with universal adaptability through the swivel collar mechanism that can accommodate various die types, sizes, and geometries without requiring physical head swapping. This multi-functional capability reduces cycle time and contamination risk while maintaining system versatility.
Solution Approach 2:
The system is pre-configured with the capability to handle multiple die types through the adjustable swivel collar, eliminating the need for preliminary head swapping operations and reducing cycle time.
4Measurement precision
If recalibration is performed before each pick and place operation to maintain precision, then placement accuracy is improved, but productivity decreases
Solution Approach 1:
The tip automatically self-aligns to each die surface through the swivel collar mechanism without requiring external recalibration operations. This self-adjusting capability maintains placement accuracy while eliminating time-consuming recalibration steps, thereby improving productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system enhances precision, accuracy, and consistency in die placement, reduces cycle times, and minimizes contamination risks, ensuring even bonding across non-planar dies and substrates, while accommodating various die types with a single system.
Implementation Method 1
a frictionless tip alignment is configured to occur
Implementation Method 2
The self-aligning tip system further comprises a spring configured to bias the tip to a neutral position
Implementation Method 3
The self-aligning tip system further comprises a magnet configured to bias the tip to a neutral position
Implementation Method 4
with the tip in an unlocked position, the tip is configured to utilize a burst or steady stream of air through the at least one air-port disposed therein to reduce the friction associated with tip alignment
Data Source
AI summary
A die placement system provides a tip body and die placement head to ensure planarity of a die to substrate without the need for calibration prior to each pick and place operation. A self-aligning tip incorporated into a tip body aids in die placement/attachment. This tip provides for global correction of planarity errors that exist between a die and substrate, regardless of whether those errors stem from gantry (i.e. die-side misalignment) or machine deck tool (i.e. substrate-side misalignment) misalignment.