Self-Assembling Polymer Sensor Module for DUV and IR Detection
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Solution Overview
Problem
Silicon sensors, such as CMOS fabricated sensors, are not sensitive to deep ultraviolet and infrared radiation, and existing DUV and IR sensors are expensive due to the costly and time-consuming process of micro-machining lenses, which are not effectively aligned with the sensors.
Innovation Solution
A sensor module incorporating self-assembling polymer and luminescent elements that convert radiation outside the visible light range to within the visible light range, using up-conversion and down-conversion luminescent elements, simplifying the manufacturing process and improving alignment between optics and sensors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If micro-machining lenses are used to extend spectral sensitivity to DUV and IR, then the sensor can detect radiation outside visible light range, but the manufacturing cost and time increase significantly
Solution Approach 1:
The patent changes the optical parameters by using luminescent materials with specific emission spectra that convert DUV and IR radiation to visible light wavelengths. This allows the same silicon sensor to detect multiple spectral ranges by simply changing the luminescent material properties rather than redesigning the optical structure
Solution Approach 2:
The patent employs composite structures combining luminescent materials (such as phosphors or quantum dots) with optical coupling materials to create a layer that simultaneously performs wavelength conversion and optical coupling functions, eliminating the need for separate micro-machined lens components
2Adaptability or versatility
If micro-machining lenses are used to extend spectral sensitivity, then radiation detection capability is improved, but manufacturing time and alignment precision requirements increase
Solution Approach 1:
The patent replaces the mechanical micro-machining process with a materials-based solution where luminescent layers are deposited or applied onto the sensor surface. This substitution eliminates complex mechanical fabrication steps and reduces manufacturing time while maintaining detection capability
Solution Approach 2:
The luminescent materials are pre-configured with specific conversion properties during material selection and deposition, allowing the wavelength conversion function to be built-in before final assembly. This preliminary configuration eliminates the need for post-assembly alignment and calibration
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables cost-effective sensing of radiation outside the visible light range by using self-assembling polymers and luminescent elements, enhancing the spectral sensitivity of silicon sensors while reducing manufacturing complexity and costs.
Implementation Method 1
The up-conversion luminescent elements may be configured to convert radiation having a wavelength above 1000 nanometer to radiation within the spectral range
Implementation Method 2
The down-conversion luminescent elements may be configured to convert radiation having a wavelength below 300 nanometer to radiation within the certain spectral range
Data Source
AI summary
A sensor module that may include optics and a sensor located downstream to the optics. The optics may include a self-assembling polymer and luminescent elements embedded in the self-assembling polymer.