Self-Biasing Heat Sink for Thin Computing Devices
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Solution Overview
Problem
Consumer devices with heat-generating components, such as processors and electronic circuitry, face challenges in achieving high performance while maintaining a thin and lightweight form factor due to heat dissipation limitations in traditional cooling solutions.
Innovation Solution
A self-biasing heat sink with a contact portion biased toward the heat generating component, utilizing a double stair-stepped configuration to ensure reliable contact without damaging the component, and incorporating a thermally and electrically conductive structure to form a Faraday cage for enhanced heat dissipation and protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional cooling solutions are used, then heat dissipation is achieved, but device thickness and weight increase
Solution Approach 1:
The heat sink employs a compliant contact portion that can dynamically adjust its position and apply variable contact force to the heat generating component. This dynamic compliance allows the heat sink to maintain effective thermal contact without requiring a fixed, bulky structure, thereby reducing device thickness while preserving heat dissipation capability.
Solution Approach 2:
The invention changes the physical state and mechanical properties of the heat sink contact portion, making it compliant rather than rigid. This parameter change allows the contact portion to deform and conform to the heat generating component surface, achieving effective thermal contact in a thinner profile and reducing overall device thickness.
2Temperature
If heat sink contact force is increased, then heat transfer efficiency improves, but damage to heat generating component occurs
Solution Approach 1:
The compliant contact portion provides dynamic adaptability in contact force application. It automatically adjusts the contact pressure to optimal levels for heat transfer while remaining below damage thresholds, eliminating the need for excessive force that would compromise component integrity.
Solution Approach 2:
The invention changes the mechanical property of the contact portion from rigid to compliant, allowing it to deform under load. This parameter change enables the system to achieve high heat transfer efficiency through increased contact area and improved thermal coupling without requiring high contact forces that could damage the heat generating component.
3Volume of moving object
If device size is reduced, then portability improves, but heat dissipation capability deteriorates
Solution Approach 1:
The heat sink utilizes a thin-film compliant contact portion that can be positioned in close proximity to the heat generating component. This thin-film approach enables effective heat dissipation in a compact volume, improving portability while maintaining thermal management capability.
Solution Approach 2:
The dynamic compliance of the contact portion allows the heat sink to maximize thermal contact within the constrained device volume. The compliant structure can deform to fill gaps and maintain contact pressure, ensuring effective heat dissipation despite the reduced available space in smaller devices.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The self-biasing heat sink effectively facilitates heat transfer with reduced thermal interface material thickness, achieving higher heat removal rates while maintaining device integrity and allowing for thinner, lighter form factors.
Implementation Method 1
The heat sink can include a contact portion that is biased toward the heat generating component to facilitate heat transfer
Implementation Method 2
material with high thermal conductivities are desirable for heat dissipation via convection from the outer surface
Data Source
AI summary
The description relates to devices, such as computing devices. One example can include a processor secured to a circuit board and a self-biasing heat sink positioned over the processor and secured to the circuit board to complete a Faraday Cage around the processor. The self-biasing heat sink can include a peripheral portion positioned in a first plane and a contact portion positioned in a second different plane and biased against the heat generating component by an interposed biasing portion that is flexed to force the contact portion against the processor.