Self-Cleaning Collimator for Uniform High-Aspect-Ratio Deposition

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Solution Overview

Problem

Existing semiconductor deposition systems face challenges in achieving uniform and efficient deposition of target materials into gaps with high aspect ratios on substrates, often resulting in incomplete filling or voids due to target material accumulation and uneven distribution.

Innovation Solution

The introduction of a self-cleaning smart collimator with a flux adjusting member that uses ultrasonic vibration and scrubbing gas to remove accumulated target material and adjust the length of adjustable hollow structures to optimize gap filling and uniform deposition.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a conventional collimator is used for deposition, then the structure is simple and easy to manufacture, but target material accumulates on the collimator surface resulting in incomplete gap filling and non-uniform deposition

Engineering Contradiction:

Improvegap filling uniformityVSAvoidcollimator structure

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The collimator incorporates adjustable hollow structures that can dynamically change their configuration during the deposition process. This dynamic adjustment capability allows the collimator to adapt to different deposition stages, optimizing material distribution and enabling complete gap filling while maintaining structural feasibility

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The collimator is divided into multiple hollow structures that can be independently adjusted. This segmentation allows different regions of the collimator to be optimized for specific deposition zones, improving overall uniformity and gap filling capability without requiring complete redesign of the entire structure

Inventive Principle:

Principle #1Segmentation

2Productivity

If the collimator operates continuously without cleaning, then the process is simple and continuous, but target material accumulation reduces deposition quality and requires frequent collimator replacement

Engineering Contradiction:

Improvedeposition continuityVSAvoiddeposition uniformity

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The collimator is equipped with self-cleaning functionality through integrated cleaning gas outlets and vibration generating units. The system can autonomously remove accumulated target material during or between deposition cycles, maintaining deposition quality without requiring external intervention or frequent manual maintenance

Inventive Principle:

Principle #25Self-service

Solution Approach 2:

The cleaning mechanism operates periodically to remove accumulated material. The vibration generating units apply periodic vibrations that, combined with cleaning gas flow, effectively dislodge and remove target material accumulation at regular intervals, ensuring continuous high-quality deposition

Inventive Principle:

Principle #19Periodic action

3Adaptability or versatility

If the collimator structure is fixed, then the device is simple to manufacture, but it cannot adapt to different gap aspect ratios and deposition requirements

Engineering Contradiction:

Improvegap filling adaptabilityVSAvoidcollimator structure

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The adjustable hollow structures allow modification of geometric parameters such as opening size and shape. By changing these parameters, the collimator can be optimized for different gap aspect ratios and deposition requirements, providing versatility without requiring multiple fixed structures

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enhances gap-fill capability, extends the interval between collimator changes, and ensures uniform deposition across all substrate areas, thereby improving production efficiency and reducing yield loss due to particle issues.

Implementation Method 1

a plurality of ultrasonic vibration generating units disposed within the collimator and configured to generate vibration to remove the accumulated target material

Methodology Applied

Scientific EffectUltrasonic vibration: Ultrasonic Vibration

Implementation Method 2

a plurality of cleaning gas outlets within the collimator and configured to direct the cleaning gas to the accumulated target material

Methodology Applied

Scientific EffectGas flow:

Implementation Method 3

The sputtering includes a target (source), and a substrate (e.g., wafer) positioned in parallel to each other in a vacuum enclosure

Methodology Applied

Scientific EffectSputtering: Sputtering

Data Source

PatentUS12331392B2Deposition system and method

Publication Date: 2025.06.17 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A deposition system is provided capable of cleaning itself by removing a target material deposited on a surface of a collimator. The deposition system in accordance with the present disclosure includes a substrate process chamber. The deposition includes a substrate pedestal in the substrate process chamber, the substrate pedestal configured to support a substrate, a target enclosing the substrate process chamber, and a collimator having a plurality of hollow structures disposed between the target and the substrate, a vibration generating unit, and cleaning gas outlet.