Self-Cleaning Collimator for High-Aspect-Ratio PVD Gap Filling
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Solution Overview
Problem
Existing deposition systems face challenges in efficiently filling gaps with high aspect ratios on semiconductor substrates during physical vapor deposition, leading to incomplete deposition and potential blockage of gaps, which affects the uniformity and yield of semiconductor devices.
Innovation Solution
A self-cleaning collimator system with adjustable hollow structures and a flux adjusting member that uses scrubbing gas and ultrasonic vibration to remove accumulated target material, allowing for enhanced gap-filling capabilities and uniform deposition across the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional deposition systems are used, then deposition can be performed on semiconductor substrates, but gaps with high aspect ratios cannot be efficiently filled, leading to incomplete deposition and potential blockage
Solution Approach 1:
The collimator is divided into multiple segments with independently adjustable hollow structures. Each segment can be individually positioned and oriented to control the deposition flux distribution, enabling precise filling of high aspect ratio gaps while maintaining system manageability
Solution Approach 2:
The collimator incorporates adjustable hollow structures that can dynamically change their configuration during deposition. This dynamic adjustability allows the system to optimize gap filling for different pattern geometries and aspect ratios, achieving high manufacturing precision without requiring completely different systems for each application
2Productivity
If target material is deposited continuously, then deposition rate is maintained, but accumulated target material on the collimator blocks the deposition flux and reduces uniformity
Solution Approach 1:
The system implements periodic cleaning cycles where the collimator is subjected to ultrasonic vibration and scrubbing gas flow at intervals during deposition. This periodic maintenance removes accumulated target material before it can significantly block the flux, allowing continuous high-rate deposition to be maintained while preserving deposition uniformity
Solution Approach 2:
The collimator is equipped with self-cleaning capabilities through integrated ultrasonic vibration generators and scrubbing gas outlets. The system automatically removes its own contaminants without requiring external intervention or system shutdown, enabling continuous productivity while maintaining precision
3Manufacturing precision
If the collimator structure is fixed, then device complexity is reduced, but it cannot adapt to different gap aspect ratios and patterns, reducing manufacturing precision
Solution Approach 1:
The collimator features adjustable hollow structures that can be dynamically reconfigured to match different gap aspect ratios and pattern geometries. This dynamic adaptability allows a single system to achieve high manufacturing precision across multiple applications without requiring multiple specialized collimators
Solution Approach 2:
The system allows adjustment of geometric parameters of the hollow structures, such as orientation angles and positioning, to optimize deposition flux distribution for different patterns. This parameter adjustability provides adaptability to various gap configurations while maintaining a relatively simple base structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively fills gaps with high aspect ratios and maintains uniform deposition rates, reducing production yield loss due to chamber particles and improving the overall efficiency and quality of semiconductor fabrication.
Implementation Method 1
A deposition system includes a collimator having a plurality of hollow structures disposed between the target and the substrate pedestal, at least one cleaning gas outlet within the collimator
Implementation Method 2
at least one vibration generating unit configured to provide vibration to the collimator
Implementation Method 3
The physical vapor deposition (PVD) is generally used to deposit one or more layers (e.g., thin film) on the semiconductor substrate
Implementation Method 4
A deposition system includes a collimator having a plurality of hollow structures disposed between the target and the substrate pedestal, at least one cleaning gas outlet within the collimator, at least one vibration generating unit configured to provide vibration to the collimator
Data Source
AI summary
A deposition system is provided capable of cleaning itself by removing a target material deposited on a surface of a collimator. The deposition system in accordance with the present disclosure includes a substrate process chamber. The deposition includes a substrate pedestal in the substrate process chamber, the substrate pedestal configured to support a substrate, a target enclosing the substrate process chamber, and a collimator having a plurality of hollow structures disposed between the target and the substrate, a vibration generating unit, and cleaning gas outlet.