Self-Crosslinkable Resist Underlayer Polymer for Low-Temperature Film Curing
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Solution Overview
Problem
Existing resist underlayer film forming compositions for semiconductor manufacturing require high-temperature heating and include crosslinking agents or catalysts, leading to issues like low etching resistance, sublimates, optical constant variations, and poor flattening and gap-filling properties, and are not suitable for non-planar substrates.
Innovation Solution
A self-crosslinkable polymer resin with alkoxymethyl groups on nitrogen atoms, allowing thermoset film formation at various temperatures without crosslinking agents or catalysts, and a resist underlayer film forming composition containing this polymer, which includes a thermal acid generator and optional crosslinking agents, solvents, and surfactants.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a crosslinking agent or crosslinking catalyst is added to form a thermoset film, then the film formation capability is improved, but etching resistance decreases and sublimates increase
Solution Approach 1:
The polymer resin performs self-crosslinking through its own functional groups (carbon-carbon triple bonds or oxazoline rings) without requiring external crosslinking agents or catalysts. The resin structure contains built-in crosslinkable groups that react with each other during heating to form a thermoset film, eliminating the need for separate crosslinking components and their associated harmful effects
Solution Approach 2:
The invention removes crosslinking agents and crosslinking catalysts from the composition entirely. By incorporating self-crosslinkable functional groups directly into the polymer resin structure, the patent extracts and eliminates the harmful components while retaining the essential thermoset film formation capability
2Reliability
If crosslinking agents or catalysts are used, then thermoset film formation is achieved, but optical constant variations and deterioration in flattening properties occur
Solution Approach 1:
The polymer resin self-crosslinks through its intrinsic functional groups, avoiding the introduction of foreign crosslinking agents that cause optical constant variations and flattening property deterioration. The self-crosslinking mechanism maintains composition simplicity and film quality
3Reliability
If high temperature heating is required for film formation, then thermoset film can be formed, but the process complexity and energy consumption increase
Solution Approach 1:
The invention changes the chemical parameters of the polymer resin by incorporating self-crosslinkable functional groups with specific reactivity. This allows the crosslinking reaction to proceed at lower temperatures compared to conventional systems requiring high-temperature heating, reducing process complexity and energy consumption while maintaining thermoset film formation capability
4Device complexity
If conventional polymer resins are used without self-crosslinking capability, then the composition is simpler, but thermoset film formation is impossible without crosslinking agents
Solution Approach 1:
The invention merges the crosslinking capability directly into the polymer resin structure by incorporating self-crosslinkable functional groups. This combines the functions of the polymer backbone and crosslinking agent into a single component, achieving thermoset film formation without separate crosslinking agents while maintaining composition simplicity
Solution Approach 2:
The polymer resin is designed as a composite structure combining the base polymer chain with embedded self-crosslinkable functional groups (carbon-carbon triple bonds or oxazoline rings). This composite material structure enables both the structural properties of the polymer and the crosslinking functionality within a single material
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The polymer resin enables cost-effective thermoset film formation in air or nitrogen atmosphere, with high etching resistance, good gap-filling properties, and suitability for non-planar substrates, reducing sublimates and improving applicability.
Implementation Method 1
a self-crosslinkable polymer comprising: (A) one or more kinds of aromatic ring-containing unit structures A; and (B) one or more kinds of unit structures B each comprising an organic group having one or more linking carbon atoms
Implementation Method 2
the composition form a thermoset film... Without such a crosslinking agent or a crosslinking catalyst, the composition is usually incapable of forming a thermoset film unless heated to an extremely high temperature
Implementation Method 3
a resist underlayer film forming composition containing a thermal acid generator
Data Source
AI summary
A self-cross-linkable polymer including unit structures A that have an aromatic ring and unit structures B that are organic groups with a connecting carbon atom, wherein: at least one kind of unit structure A is (i) a unit structure in which an —NR— bond connects at least two aromatic rings, (ii) a unit structure including a heterocyclic structure having at least one —NR— bond as a ring structural element, or (iii) a unit structure including an aromatic ring that has at least one —NR2 substituent group; R is a hydrogen atom or alkoxymethyl group; at least some of the Rs in the entire polymer are alkoxymethyl groups; and the connecting carbon atom is a carbon atom in a unit structure B that forms a covalent bond with an aromatic ring in a unit structure A and is a carbon atom that does not form an aromatic ring.