Self-Docking Optical PCB Connector for Semiconductor Packages
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Solution Overview
Problem
Current photonics packaging methods are labor-intensive, costly, and not scalable for high-volume manufacturing due to the need for precise alignment and large PIC dies for V-groove formation, leading to increased assembly costs and yield loss of expensive fiber array units.
Innovation Solution
Integration of a substrate with a mechanical alignment system and expanded beam coupling for optical connectors, allowing for self-docking and self-alignment of fiber connectors within a package socket, enabling free-space coupling and reduced precision dependencies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If optical fibers are directly coupled to PIC using V-grooves, then optical coupling is achieved, but assembly complexity and labor intensity increase significantly
Solution Approach 1:
The patent introduces an interposer substrate as an intermediary component between the optical connector and the PIC package. This interposer provides a mechanical interface with alignment features (such as grooves or protrusions) that facilitate precise positioning without requiring direct manual alignment and bonding of optical fibers to the PIC, thereby simplifying the assembly process while maintaining optical coupling reliability
Solution Approach 2:
The patent replaces the traditional mechanical alignment and bonding system with a self-aligning mechanical interface. The alignment features (grooves, protrusions, or keyed interfaces) enable automatic mechanical positioning of the optical connector relative to the PIC package, eliminating the need for complex alignment tools and bonding processes
2Manufacturing precision
If precise alignment tools and methods are used, then optical fiber alignment accuracy improves, but manufacturing cost and time increase
Solution Approach 1:
The patent incorporates alignment features (such as grooves, protrusions, or keyed interfaces) into the mechanical structure of the interposer and optical connector during the manufacturing stage. These pre-built features ensure that when components are assembled, alignment occurs automatically without requiring additional alignment operations during manufacturing, thus maintaining high precision while improving assembly speed
Solution Approach 2:
The alignment features are designed to enable self-alignment of the optical connector with the PIC package. The mechanical interface automatically positions components correctly through features like tapered grooves or complementary shapes, eliminating the need for external alignment tools or skilled operators, thereby achieving both high precision and high productivity
3Reliability
If larger PIC dies are used for V-groove formation, then optical interface functionality is improved, but device area and cost increase
Solution Approach 1:
The patent separates the optical interface functionality from the PIC die itself by introducing an interposer substrate. The V-grooves or alignment features are formed on the interposer rather than requiring large areas on the PIC die. This segmentation allows the PIC die to remain compact while the optical interface functions are provided by the separate interposer component
Solution Approach 2:
The patent moves the optical interface structures (V-grooves, alignment features) from the PIC die plane to a separate interposer substrate layer. This dimensional separation allows the PIC die to maintain its original small footprint while the optical interface functionality is implemented on the interposer, effectively adding the optical interface capability in another structural dimension
4Manufacturing precision
If manual alignment and bonding processes are used, then optical fiber positioning accuracy is achieved, but assembly cost and labor intensity increase
Solution Approach 1:
The patent replaces manual alignment and bonding mechanical processes with a self-aligning mechanical interface. The interposer and optical connector are designed with complementary alignment features (grooves, protrusions, keyed interfaces) that automatically position components correctly during assembly, eliminating the need for manual alignment operations and reducing both labor costs and assembly complexity
Solution Approach 2:
The alignment features are designed to enable self-alignment of the optical connector with the PIC package. The mechanical interface automatically positions components correctly through features like tapered grooves or complementary shapes, eliminating the need for external alignment tools or skilled operators, thereby achieving both high precision and high productivity
Data Source
AI summary
Embodiments disclosed herein include an electronic system. In an embodiment, the electronic system comprises a board, and a package substrate coupled to the board. In an embodiment, a photonics integrated circuit (PIC) is coupled to the package substrate. In an embodiment, an optical lens is on the PIC, and an optical connector is on the board. In an embodiment, the optical connector passes through an opening through the package substrate and is optically coupled with the optical lens on the PIC.