Self-Emission Panel Surface Treatment for Emission Failure Prevention
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Solution Overview
Problem
Self-emission panels, such as organic electroluminescence (EL) panels, face performance deterioration and emission failures due to short circuits caused by foreign substances like dust adhering to the first conductive layer, which are difficult to remove after the formation of sectioning layers and deposition preprocessing steps.
Innovation Solution
A method involving surface treatment of the first conductive layer after forming sectioning layers, followed by deposition, to prevent short circuits and emission failures, where the surface treatment creates a thin portion of the first conductive layer for effective contact with the deposition layer, avoiding damage to existing structures like sectioning layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If surface polishing is performed on the first conductive layer before deposition, then surface flatness is improved, but foreign substances can still adhere during subsequent processing steps
Solution Approach 1:
The patent applies surface treatment to the first conductive layer immediately before the deposition step, ensuring the surface is clean and ready for deposition. This preliminary action prevents foreign substance adhesion at the critical interface between the first conductive layer and deposition layer, resolving the contradiction by timing the surface treatment to occur after sectioning layer formation but before deposition.
2Manufacturing precision
If sectioning layers and barrier portions are formed on the first conductive layer, then emission area definition is improved, but surface treatment becomes difficult without damaging existing structures
Solution Approach 1:
The patent applies surface treatment selectively to specific regions of the first conductive layer - namely the regions that will become the emission areas after sectioning layer removal. This local quality approach ensures that surface treatment is applied only where needed for deposition, avoiding damage to sectioning layers and barrier portions while still achieving the required surface quality for light emission.
3Device complexity
If multiple processing steps are performed before deposition, then structural complexity is improved, but the risk of foreign substance adhesion increases
Solution Approach 1:
The patent performs surface treatment as a preliminary action immediately before the deposition step, after all structural elements (sectioning layers, barrier portions) have been formed. This timing ensures that the complex structure is in place while the surface treatment prepares the first conductive layer for deposition without exposing it to prolonged contamination risk from multiple intermediate processing steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively prevents emission failures by removing foreign substances and ensuring a smooth deposition process, resulting in improved light emission characteristics and reduced manufacturing complexity.
Implementation Method 1
applying surface treatment to at least a surface of the first conductive layer inside the opening
Implementation Method 2
depositing the deposition layer at least on the first conductive layer that is given the surface treatment
Data Source
AI summary
A self-emission panel and a method of manufacturing a self-emission panel which can prevent emission failures from occurring due to various factors, thereby achieving a self-emission panel that is free from emission failures. The self-emission panel is manufactured by forming a first conductive layer on a substrate directly or via other layers, forming a deposition layer including a luminescent layer on the first conductive layer, and forming a second conductive layer on the deposition layer. This manufacturing method includes: a first step of forming a sectioning layer for sectioning an opening for making a emission area on the first conductive layer after the formation of the first conductive layer; a second step of applying surface treatment to at least the surface of the first conductive layer inside the opening; and a third step of depositing a deposition layer on the first conductive layer given surface treatment in the second step.