Fiber-Reinforced Self-Healing Cap for Liquid Metal Sockets
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Solution Overview
Problem
Existing liquid metal socket architectures face challenges in maintaining dimensional stability and preventing liquid metal leakage due to the poor performance of self-healing polymers, which deform upon repeated healing processes, affecting the reliability and electrical performance of electronic systems.
Innovation Solution
A hybrid cap layer is introduced, comprising a self-healing polymer embedded with woven or randomly distributed glass fibers, which provides enhanced dimensional stability and allows for multiple self-healing cycles without significant shape deformation, ensuring effective containment of liquid metal and preventing oxidation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a self-healing polymer is used for the cap layer, then holes formed during pin insertion can be removed and the cap can seal itself, but the dimensional stability of the cap layer deteriorates due to deformation upon repeated healing processes
Solution Approach 1:
The patent applies composite materials by combining self-healing polymer with glass fibers to create a hybrid cap layer. The glass fibers provide dimensional stability and structural support, preventing the deformation issues that plague pure self-healing polymers during repeated healing cycles. Meanwhile, the self-healing polymer matrix maintains its ability to seal holes formed during pin insertion, thus resolving the contradiction between self-healing capability and dimensional stability.
2Quantity of substance
If the cap thickness is reduced to minimize material usage, then manufacturing cost decreases, but the liquid metal may leak out during socket de-actuation
Solution Approach 1:
The composite structure of self-healing polymer reinforced with glass fibers enables the cap layer to maintain adequate thickness for reliable liquid metal containment while optimizing material distribution. The glass fiber reinforcement provides structural integrity that allows for thinner overall cap designs without compromising containment reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The hybrid cap layer effectively seals holes formed by pin insertion, maintains the shape integrity, and enhances the reliability of liquid metal containment, improving the electrical performance and ease of assembly and disassembly of electronic systems.
Implementation Method 1
A self-healing polymer has the advantage of being able to remove holes through the cap formed during the repeated insertion of pins through the cap
Implementation Method 2
the dimensional stability of such cap layers is not good, and renders self-healing materials not suitable for many applications
Implementation Method 3
Liquid metal carrier array (LMCA) interconnects use a cap layer that prevents the conductive liquid metal from leaking out during socket de-actuation
Implementation Method 4
There are also electrical properties and moisture barrier requirements to improve device electrical performance and reliability
Data Source
AI summary
Embodiments disclosed herein include a package substrate. In an embodiment, the package substrate comprises a substrate with a layer on the substrate. In an embodiment, the layer comprises a plurality of wells. In an embodiment, a liquid metal is in the plurality of wells. In an embodiment, a cap is on the layer to seal the plurality of wells, where the cap comprises a polymer, and fibers within the polymer.