Self-Healing FET Using Disulfide PUU Polymer

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Solution Overview

Problem

Current field-effect transistors (FETs) lack self-healing capabilities at room temperature and are unable to maintain structure and function after mechanical damage without specific treatments, limiting their durability and reliability in flexible and wearable electronic devices.

Innovation Solution

A self-healing FET is developed using a combination of conducting and semi-conducting elongated nanostructures with a thin self-healing dielectric layer made from a disulfide-containing poly(urea-urethane) (PUU) polymer, which provides intrinsic self-healing properties and allows for the restoration of electrical and mechanical properties after damage without external triggers.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If soft and flexible materials are used to enable conformal attachment and stretchability, then device flexibility and comfort are improved, but mechanical stability and durability deteriorate due to susceptibility to cracks and scratches

Engineering Contradiction:
ImproveflexibilityVSAvoidmechanical stability
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The patent incorporates self-healing capabilities into the device structure before damage occurs. The encapsulation layer and self-healing materials are pre-designed to automatically repair cracks and scratches when they form, preventing mechanical instability from developing into device failure.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent uses composite material structures combining flexible polymers with self-healing additives and protective encapsulation layers. This creates a multi-layer system that maintains flexibility while providing crack resistance and self-repair capabilities to counteract mechanical degradation.

Inventive Principle:
Principle #40Composite materials

2Ease of manufacture

If conventional FET structures are used, then device simplicity and manufacturing ease are maintained, but self-healing capability and durability are lost due to inability to recover from mechanical damage

Engineering Contradiction:
Improvedevice simplicityVSAvoidself-healing capability
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent modifies the material parameters of conventional FET structures by incorporating self-healing polymers and encapsulation materials. These parameter changes enable the device to automatically repair mechanical damage while maintaining compatibility with existing manufacturing processes.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent introduces encapsulation layers and self-healing materials as intermediary components between the FET active elements and the external environment. These intermediaries protect the device from mechanical damage and enable self-repair without interfering with the core FET functionality.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Measurement precision

If thin dielectric layers are used to improve device performance, then sensing sensitivity is enhanced, but mechanical robustness and damage resistance deteriorate

Engineering Contradiction:
Improvesensing sensitivityVSAvoidmechanical robustness
Core Design Contradiction:
Measurement precisionVSStrength

Solution Approach 1:

The patent employs composite dielectric structures that combine thin functional layers with self-healing polymer materials. The thin dielectric layer provides sensing sensitivity while the self-healing polymer matrix provides mechanical robustness and crack resistance, creating a synergistic composite structure.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent uses flexible self-healing polymer encapsulation layers that can conform to thin dielectric structures. These flexible shells provide mechanical protection and self-repair capabilities while allowing the thin dielectric layer to maintain its sensing functionality.

Inventive Principle:
Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The self-healing FET exhibits repeatable and autonomous recovery from micro-scale damage and complete cuts, maintaining sensitivity for temperature and humidity sensing, enhancing the durability and reliability of flexible electronic devices.

Implementation Method 1

a self-healing dielectric layer made from a disulfide-containing poly(urea-urethane) (PUU) polymer, which provides intrinsic self-healing properties

Methodology Applied
Scientific EffectDynamic covalent bond exchange: Chemical Bonding

Implementation Method 2

for the detection of temperature and humidity

Methodology Applied
Scientific EffectTemperature sensing: Thermal Expansion

Implementation Method 3

for the detection of temperature and humidity

Methodology Applied
Scientific EffectHumidity sensing: Absorption (physical)

Implementation Method 4

a self-healing dielectric layer made from a disulfide-containing poly(urea-urethane) (PUU) polymer

Methodology Applied
Scientific EffectDielectric permittivity: Dielectric Permittivity

Data Source

PatentEP3841377B1Multi-functional field effect transistor with intrinsic self-healing properties
Publication Date: 2024.10.02 TECHNION RES & DEV FOUND LTD
  • EP3841377B1 patent drawingFigure 1A~1B
  • EP3841377B1 patent drawingFigure 2A~2B
  • EP3841377B1 patent drawingFigure 3

AI summary

The present invention provides a self-healing field-effect transistor (FET) device comprising a self-healing substrate and a self-healing dielectric layer, said substrate and said layer comprising a disulfide-containing poly(urea-urethane) (PUU) polymer, wherein the dielectric layer has a thickness of less than about 10 µm, a gate electrode, at least one source electrode, and at least one drain electrode, said electrodes comprising electrically conductive elongated nanostructures; and at least one channel comprising semi-conducting elongated nanostructures. Further provided is a method for fabricating the FET device.