Explosion-Resistant Electronic Module with Self-Healing Gel Encapsulation
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Solution Overview
Problem
Existing electronic modules in field devices face limitations in data transmission speed due to explosion protection requirements, which slow down the programming process, as they need to adhere to energy and power restrictions through explosion-resistant interfaces.
Innovation Solution
An electronic module with a self-healing gelatinous potting compound encapsulation that allows for high-speed data transmission while maintaining explosion protection, using a contact pin to connect with the module's electrical contact area, which re-seals after pin removal, and optionally reinforcing the contact area with solder for improved connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If explosion protection standards are applied to electrical interfaces, then safety is improved, but data transmission speed deteriorates
Solution Approach 1:
The electrical interface is segmented into two distinct parts: an explosion-safe interface for power supply and basic communication, and a non-explosion-protected high-speed interface for rapid data transmission and programming. This segmentation allows each interface to be optimized for its specific function without compromise.
Solution Approach 2:
A programmable logic component (PLC or FPGA) acts as an intermediary between the explosion-safe interface and the high-speed interface. It translates and manages data flow between the two interfaces, enabling fast programming through the high-speed interface while maintaining explosion protection through the safe interface.
2Reliability
If traditional explosion-resistant interfaces are used, then safety is maintained, but programming time increases
Solution Approach 1:
The interface is divided into explosion-protected and non-protected segments, allowing programming operations to occur through the fast, non-protected interface without compromising safety through the protected interface.
Solution Approach 2:
The mechanical limitation of using only slow, explosion-protected interfaces is replaced by introducing a high-speed electronic interface that bypasses the speed limitation while safety is maintained through the separate protected interface and programmable logic mediation.
3Productivity
If high-speed data transmission is enabled, then programming efficiency is improved, but explosion protection is compromised
Solution Approach 1:
The system segments communication functions into high-speed data transmission through a non-protected interface and safety-critical communication through an explosion-protected interface, allowing both high productivity and safety coexist.
Solution Approach 2:
Different parts of the interface have different safety qualities: the programming interface is designed for high speed without explosion protection, while the operational interface maintains explosion protection. Each local region is optimized for its specific quality requirement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables fast data transmission without compromising explosion protection, allowing for efficient programming of electronic modules in field devices by utilizing a self-healing potting compound that re-seals after contact pin removal, thus bypassing the limitations of traditional explosion-resistant interfaces.
Implementation Method 1
the puncture location of a contact pin in the gelatinous potting compound automatically re-seals after removal of the contact pin
Implementation Method 2
the encapsulation is filled at least between the at least one contact area and the portion with a gelatinous potting compound
Implementation Method 3
the at least one electrical contact area is contactable by means of at least one electrical contact pin, for example, a spring contact pin
Data Source
AI summary
The present disclosure relates to an explosion resistant electronic module having a high-speed interface and a method for electronic contacting of such electronic module via such interface. The electronic module includes an electronic component, an electrical contact area for electrical contacting the electronic component and an encapsulation, which encapsulates at least the electrical contact area. The encapsulation is embodied such that the contact area is contactable through the encapsulation by an electrical contact pin, wherein the encapsulation is filled at least in a portion with a self-healing gelatinous potting compound, which enables the encapsulation to be re-sealed after removal of the contact pin.
