Self-Heating Effect Model Dynamic Thermal Parameters
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Solution Overview
Problem
Conventional self-heating effect models fail to accurately simulate the heat flow network of devices due to fixed thermal capacity and resistance values, which limits their ability to characterize heat flow under varying conditions, especially when devices are surrounded by adjacent devices and operate in different environments.
Innovation Solution
A self-heating effect apparatus and method that includes a processor and memory to execute a self-heating effect model, which incorporates a thermal temperature feedback model, thermal resistance modification model, and thermal capacity modification model to accurately characterize the thermal level and modified thermal resistance and capacity of devices under test, considering the influence of adjacent devices, distance, vertical thermal diffusion, power, and ambient temperature.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional self-heating effect models use fixed thermal capacity and resistance values, then the model structure is simple, but the simulation accuracy of heat flow network deteriorates under varying conditions
Solution Approach 1:
The patent applies dynamics by transitioning from fixed thermal capacity and resistance values to dynamic models where these parameters vary with temperature. The thermal capacity modification model adjusts thermal capacity based on temperature changes, and the thermal resistance modification model adjusts thermal resistance based on temperature, enabling the model to adapt to varying operating conditions and improve simulation accuracy.
Solution Approach 2:
The patent changes physical parameters by introducing temperature-dependent variations in thermal capacity and thermal resistance. The modification models use temperature as a variable to adjust these parameters, allowing the heat flow network simulation to accurately reflect real-world conditions where thermal properties change with temperature.
2Measurement precision
If the model considers adjacent devices and environmental factors, then the simulation accuracy improves, but the computational complexity increases
Solution Approach 1:
The patent segments the heat flow network into distinct components: the device under test, adjacent devices, and environmental factors. Each component is modeled separately with its own thermal capacity and resistance parameters, allowing the complex system to be analyzed through manageable segments while maintaining overall accuracy.
Solution Approach 2:
The patent implements feedback mechanisms where the thermal levels of adjacent devices and environmental conditions feed back into the calculation of the device under test's thermal characteristics. The modification models use feedback from temperature measurements and environmental data to dynamically adjust the thermal parameters, improving simulation accuracy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables accurate characterization of the heat flow network of devices, improving the simulation's accuracy by dynamically adjusting thermal resistance and capacity based on changing conditions, thereby enhancing the simulation of device self-heating effects.
Implementation Method 1
a vertical thermal diffusion level of the device under test
Implementation Method 2
a modified thermal resistance of the device under test according to the thermal level of the device under test and the reference thermal resistance
Implementation Method 3
a modified thermal capacity of the device under test according to the thermal level of the device under test and the reference thermal capacity
Data Source
AI summary
A self-heating effect apparatus includes a memory and a processor. The processor is coupled to the memory and configured to process a self-heating effect model for characterizing a heat flow network of devices. The devices include a device under test and one or more adjacent devices surrounding the device under test. The self-heating effect model includes a reference thermal resistance and a reference thermal capacity; a thermal temperature feedback model used to acquire a thermal level of the device under test; a thermal resistance modification model used to acquire a modified thermal resistance of the device under test according to the thermal level of the device under test and the reference thermal resistance; and a thermal capacity modification model used to acquire a modified thermal capacity of the device under test according to the thermal level of the device under test and the reference thermal capacity.