Self-Hermetic Laser Diode Coating for Moisture-Resistant Assembly
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Solution Overview
Problem
The existing semiconductor laser components require hermetic sealing to prevent moisture penetration, which increases the cost and complexity of assembly due to high mounting alignment requirements.
Innovation Solution
The optical device incorporates a semiconductor stack structure with an anti-reflective film and a highly-reflective film, both made of high refractive index materials, to enhance light transmittance and reduce losses, while a capping layer provides additional moisture protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a package housing with cylindrical cover is used to hermetically seal the laser diode chip, then moisture resistance is improved, but device complexity and assembly difficulty increase
Solution Approach 1:
The patent combines the hermetic sealing function and the optical reflection function into a single integrated reflective film layer formed directly on the laser diode chip. This eliminates the need for separate package housing components (base, cylindrical cover, lens) and their complex assembly, while maintaining moisture protection through the reflective film's hermetic barrier properties.
Solution Approach 2:
The reflective film serves multiple functions simultaneously: it provides hermetic sealing to prevent moisture penetration, acts as a highly reflective surface to improve laser beam extraction efficiency, and eliminates the need for separate packaging components. This multi-functional design simplifies the overall device structure while maintaining reliability.
2Reliability
If a package housing with cylindrical cover is used to hermetically seal the laser diode chip, then moisture resistance is improved, but manufacturing cost increases
Solution Approach 1:
The patent merges the hermetic sealing function and the optical reflection function into a single integrated reflective film layer formed directly on the laser diode chip. This eliminates the need for separate package housing components (base, cylindrical cover, lens) and their complex assembly, while maintaining moisture protection through the reflective film's hermetic barrier properties.
Solution Approach 2:
The patent extracts and eliminates unnecessary package housing components (base, cylindrical cover, lens) from the traditional semiconductor laser structure, retaining only the essential laser diode chip with an integrated reflective film that provides both hermetic sealing and optical reflection functions.
3Use of energy by moving object
If anti-reflective film and highly-reflective film with high refractive index are used, then light transmittance is improved, but manufacturing complexity increases
Solution Approach 1:
The patent combines the anti-reflective film and highly-reflective film into a single integrated reflective film structure with alternating high and low refractive index layers. This unified structure achieves both anti-reflection and high reflection functions simultaneously, simplifying the manufacturing process while improving light transmittance and reducing optical losses.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows the optical device to operate effectively in high humidity environments without the need for additional metal or ceramic packaging, reducing costs and simplifying assembly.
Implementation Method 1
the anti-reflective film is disposed on the front facet, and is configured to increase the transmittance of the laser beam
Implementation Method 2
the highly-reflective film is disposed on a rear facet of the semiconductor stack structure, and the highly-reflective film is configured to reduce a loss of the laser beam transmitted to the rear facet
Implementation Method 3
a capping layer disposed on a top facet of the semiconductor stack structure
Data Source
AI summary
The present application provides an optical device and a method of fabricating the same. The optical device include a semiconductor stack structure, an anti-reflective film and a highly-reflective film. The semiconductor stack structure is configured to generate a laser beam and emit the laser beam from its front facet while receiving an electric current. The anti-reflective film is disposed on the front facet of the semiconductor stack structure and configured to increase the transmittance (reduce a reflectivity) of the front facet to the laser beam. The highly-reflective film is disposed on a rear facet of the semiconductor stack structure and is configured to reduce a loss (increase a reflectivity) of the laser beam transmitted to the rear facet. The anti-reflective film and the highly-reflective film respectively have refractive indices greater than 2, and the highly-reflective film has a thickness greater than that of the anti-reflective film.