Self-Locating Electronics Package with Flex Circuit Branches
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional packaging for miniaturized electronics in self-propelled munitions is too large and complex, requiring specialized components that add weight and complexity without enhancing functionality, particularly in terms of mechanical support and inter-component wiring.
Innovation Solution
A self-locating electronics package structure comprising mutually parallel, vertically spaced circuit boards and a flex circuit with branching connections that eliminate the need for mechanical components for board spacing, using a method of assembly where circuit boards are aligned and secured by baffles and flex circuit branches to form a compact, high-density package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional packaging structures are used for miniaturized electronics, then mechanical support and inter-component wiring can be provided, but the package size and weight increase and complexity is added
Solution Approach 1:
The patent combines multiple functions into the circuit boards themselves. The circuit boards provide both electrical interconnection and mechanical support structures. The inter-component wiring is integrated directly into the circuit board traces, eliminating the need for separate mechanical support structures and wiring harnesses, thereby reducing package size and complexity
Solution Approach 2:
The circuit boards serve multiple functions simultaneously: they provide electrical connections between components, mechanical support for mounting electronic components, structural framework for the package, and inter-component wiring through integrated traces. This multi-functionality eliminates the need for specialized components that add weight and complexity
2Reliability
If specialized components and structural features are added to conventional packaging, then mechanical support and wiring functionality is enhanced, but weight and complexity increase
Solution Approach 1:
The patent merges the functions of mechanical support structures and wiring into the circuit boards themselves. The circuit boards provide both structural support for mounting components and electrical interconnection through integrated traces, eliminating the need for separate specialized components that would add weight while maintaining reliability and functionality
3Reliability
If specialized components and structural features are added to conventional packaging, then mechanical support and wiring functionality is enhanced, but complexity increases
Solution Approach 1:
The patent combines mechanical support and wiring functions into the circuit boards, eliminating the need for separate specialized components and structural features. The circuit boards themselves provide the structural framework and electrical interconnection, significantly reducing overall package complexity while maintaining full functionality
Solution Approach 2:
The circuit boards serve as multi-functional elements that simultaneously provide mechanical support, electrical interconnection, and structural framework. This universality eliminates the need for multiple specialized components, thereby reducing device complexity while enhancing reliability through integrated design
Data Source
AI summary
An electronics package comprising a plurality of mutually parallel, vertically spaced circuit boards of generally circular configuration and electrically connected by a flex circuit comprising a trunk extending circumferentially around the circuit boards and having a branch extending to each circuit board. An electronics package precursor structure and a method of configuring the electronics package from the precursor structure is also disclosed.