Self-Plasma Chamber Shielding for Sputter Contamination Control
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Solution Overview
Problem
The self-plasma chamber in semiconductor deposition processes is prone to contamination from metallic materials sputtered during plasma generation, leading to reduced measurement reliability and shortened lifespan due to internal contamination and window transmittance issues.
Innovation Solution
A shielding apparatus is installed adjacent to the ground electrode in the self-plasma chamber, comprising a non-metallic shield ring or baffle plate to prevent contaminants generated by plasma collisions from reaching the window, and an additional electromagnetic field generator to divert contaminants away from the window.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a self-plasma chamber is connected to an exhaust pipe of a process chamber to monitor deposition processes, then real-time process monitoring capability is improved, but contamination of the self-plasma chamber from process materials causes measurement reliability to deteriorate
Solution Approach 1:
An electromagnetic field generator is introduced as an intermediary device between the process chamber exhaust and the self-plasma chamber. This electromagnetic field acts as a mediator to deflect contaminated materials away from the self-plasma chamber window, allowing the monitoring function to continue while protecting against contamination.
Solution Approach 2:
The solution introduces a new dimension of control by applying electromagnetic fields to manipulate the trajectory of contaminated materials. Instead of only considering linear flow paths, the electromagnetic field adds a dimensional control mechanism that redirects contaminants away from the sensitive window area.
2Measurement precision
If plasma discharge is performed in the self-plasma chamber to generate signals for monitoring, then process monitoring capability is improved, but sputtering of ground electrode materials causes internal contamination that deteriorates measurement reliability
Solution Approach 1:
A shielding structure is introduced as a physical intermediary between the ground electrode and the self-plasma chamber interior. This shield blocks the direct path of sputtered materials, preventing them from contaminating the chamber while allowing the plasma discharge to continue for monitoring purposes.
Solution Approach 2:
The self-plasma chamber is segmented into distinct zones: a plasma generation zone near the ground electrode and a measurement zone near the window. The shielding structure creates a physical separation that allows plasma discharge to occur without directly contaminating the measurement area.
3Productivity
If the self-plasma chamber operates continuously to monitor deposition processes, then productivity is improved, but rapid contamination shortens the chamber lifespan that deteriorates durability
Solution Approach 1:
Protective structures (electromagnetic field generator and shielding) are installed in advance within the self-plasma chamber to prevent contamination before it occurs. This preliminary protection allows the chamber to operate continuously without accumulating contamination that would otherwise shorten its lifespan.
Solution Approach 2:
The electromagnetic field and shielding structures act as a protective buffer against contamination. By providing this cushioning protection beforehand, the chamber can maintain its operational integrity over extended periods, enabling continuous monitoring without frequent replacement or maintenance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively prevents contamination of the self-plasma chamber, enhancing measurement reliability and extending its lifespan by blocking contaminants and maintaining window transmittance.
Implementation Method 1
The contamination causing material is subjected to Lorentz force by the electromagnetic field generator 120 that generates a magnetic field, and thus deviates from the straight path directed towards the window.
Implementation Method 2
a plasma generating unit that generates plasma in the discharge chamber
Implementation Method 3
a sputtering phenomenon occurs and the negative electrode material moves towards the window, thus causing the contamination
Data Source
AI summary
The present invention relates to a technology for increasing the reliability of measurement by preventing the contamination of a self-plasma chamber provided in order to monitor a deposition operation performed in a process chamber, and has a shielding means capable of preventing an inflow of negative electrode material, which is generated by a sputtering phenomenon, into a discharge chamber when a positive charge of plasma, which is generated in the self-plasma chamber, collides with a negative electrode.