Self-Positioning Substrate Device for Semiconductor Inspection
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Solution Overview
Problem
Current substrate processing in semiconductor manufacturing lacks efficient methods for precise positioning of substrates during inspection and analysis, often requiring manual intervention and time-consuming processes to locate small-scale defects or particles.
Innovation Solution
A substrate device with integrated electronics and positional targets that uses both coarse and fine position measurements, combined with wireless communication, to accurately position itself on a support surface, enabling automated and precise alignment without human intervention.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If manual positioning methods are used for substrate alignment, then operational flexibility is maintained, but positioning time and labor intensity increase significantly
Solution Approach 1:
The substrate device performs self-positioning by automatically detecting its own coordinates through integrated position units and communicating them to the substrate handler, eliminating the need for manual intervention and significantly reducing positioning time while maintaining simplicity
Solution Approach 2:
The patent replaces manual mechanical positioning operations with an automated system using optical position units, Vernier patterns, and wireless communication to determine and transmit substrate coordinates, thereby increasing positioning speed without proportionally increasing system complexity
2Measurement precision
If high precision positioning is required for electron microscope inspection, then measurement accuracy improves, but the field of view narrows and positioning complexity increases
Solution Approach 1:
The positioning system is segmented into two levels: coarse position units for general localization and fine position units for precise alignment. This hierarchical segmentation enables high measurement precision while managing system complexity through modular design
Solution Approach 2:
The patent introduces a new dimension of automation by integrating position units directly into the substrate device and using wireless communication to transmit coordinate information, transforming the positioning problem from a manual 2D alignment task to an automated multi-dimensional coordinate system solution
3Productivity
If automated positioning systems are implemented, then productivity increases, but system complexity and initial setup requirements increase
Solution Approach 1:
The substrate device autonomously determines its own position coordinates and communicates them to the handler without requiring external manual setup or calibration, making the automated system easy to operate while maintaining high productivity
Solution Approach 2:
The system implements automatic feedback loops where position units continuously monitor substrate coordinates, wireless communication transmits this information to the handler, and the handler adjusts positioning based on received data, enabling high-speed automated operation with simplified setup procedures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates automated, real-time precise positioning of substrates, reducing manual effort and increasing efficiency in substrate inspection and analysis by providing accurate positional feedback to handlers, enhancing the accuracy and speed of defect detection and data collection.
Implementation Method 1
an optical position unit configured to measure a position of the substrate device relative to the substrate support surface
Implementation Method 2
measure positional offsets between the substrate device and the substrate support surface using proximity optics
Implementation Method 3
using proximity optics and Vernier patterns for accurate alignment
Data Source
AI summary
Some aspects of the present disclosure relate to a system having a substrate device, a substrate support surface, and a substrate handler that positions the substrate device on the substrate support surface. The substrate device and the substrate support surface may have counterpart coarse position units and fine position units. The system may measure coarse positional offsets between the first and second coarse position units, re-position the substrate device on the substrate support surface based on the coarse positional offsets, and subsequently measure fine positional offsets between the first and second fine position units. In some implementations, the substrate device is integrally coupled to the substrate handler via a wireless communication link in order to communicate position information as feedback for further placement.