Self-Powered Electrostatic Chuck for High-Speed Substrate Transfer

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Solution Overview

Problem

Conventional substrate handling systems face limitations in transfer speed due to insufficient gripping force, leading to substrate slippage and transfer errors, and mechanical solutions introduce complexity and particle contamination.

Innovation Solution

A vacuum robot with an electrostatic chuck and an internal electrical generation system that uses relative motion between dual arms to generate electrostatic force, enhancing substrate holding during high-speed transfers without mechanical means.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Force

If mechanical gripping mechanisms are used to hold substrate during high-speed transfer, then substrate holding force is improved, but device complexity and particle contamination increase

Engineering Contradiction:

Improvesubstrate holding forceVSAvoidmechanical mechanism complexity

Core Design Contradiction:

ForceVSDevice complexity

Solution Approach 1:

The patent replaces mechanical gripping mechanisms with an electrostatic chuck that uses electrostatic forces to hold the substrate. The electrostatic chuck comprises a chucking electrode that generates electrostatic attraction force to secure the substrate during high-speed transfer, eliminating the need for complex mechanical pins and clamps while reducing particle contamination risk

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the physical state and properties of the chucking surface by applying high voltage to the chucking electrode, creating an electrostatic field that generates sufficient holding force. The system dynamically adjusts voltage parameters to maintain optimal gripping force during acceleration and deceleration phases of substrate transfer

Inventive Principle:

Principle #35Parameter changes

2Reliability

If mechanical gripping mechanisms are used to prevent substrate slippage, then transfer stability is improved, but particle contamination increases

Engineering Contradiction:

Improvetransfer stabilityVSAvoidparticle contamination

Core Design Contradiction:

ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The patent eliminates mechanical contact between the substrate and gripping mechanisms by using electrostatic attraction. The electrostatic chuck creates a uniform electric field that holds the substrate without physical pins or clamps, thereby preventing mechanical wear and particle generation while maintaining transfer stability during high-speed operations

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Productivity

If gravitational and friction forces are used to constrain substrate, then system simplicity is maintained, but robot speed is limited

Engineering Contradiction:

Improverobot transfer speedVSAvoidsubstrate constraint reliability

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The patent changes the fundamental constraint mechanism from passive gravitational and friction forces to active electrostatic forces. By applying high voltage to the chucking electrode, the system generates electrostatic attraction force that scales with acceleration, enabling reliable substrate constraint during high-speed transfer operations that would otherwise cause slippage

Inventive Principle:

Principle #35Parameter changes

4Force

If additional wiring and tubing are added to implement mechanical solutions, then substrate holding capability is improved, but system complexity and transfer process complexity increase

Engineering Contradiction:

Improvesubstrate gripping forceVSAvoidwiring and tubing complexity

Core Design Contradiction:

ForceVSDevice complexity

Solution Approach 1:

The patent merges the substrate holding function directly into the end effector structure itself. The electrostatic chuck is integrated into the end effector, eliminating the need for separate mechanical gripping devices, additional wiring harnesses, and tubing connections. This integration simplifies the overall system while maintaining effective substrate holding capability

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system enables faster substrate transfers with improved stability and reduced particle contamination by leveraging electrostatic forces, overcoming the limitations of conventional systems.

Implementation Method 1

an electrostatic chuck and an internal electrical generation system that uses relative motion between dual arms to generate electrostatic force, enhancing substrate holding during high-speed transfers

Methodology Applied

Scientific EffectElectrostatic force: Electrostatics

Implementation Method 2

an internal electrical generation system that uses relative motion between dual arms to generate electrostatic force

Methodology Applied

Scientific EffectElectromagnetic induction: Electromagnetic Induction

Data Source

PatentUS20250353190A1End-effector with self powered electrostatic chuck

Publication Date: 2025.11.20 ASM IP HLDG BV

AI summary

A vacuum robot includes an end effector comprising an electrostatic chuck and an electrical generator coupled to the end effector to provide a chucking voltage to the end effector to activate the electrostatic chuck. The electrical generator may include generating electrical energy from at least one of: a light source, a laser source, or a set of electrical coils in a magnetic field.